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NCP301HSN30T1G

Onsemi

NCP301HSN30T1G by Onsemi

NCP301HSN30T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, CMOS technology, and operates b/w -40°C to 125°C. The IC has dual terminals with matte tin finish and is surface mountable.

Median Price

$0.241

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 78,000 parts In-Stock

1+ parts

-

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78,000

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Rochester

USA . 174 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

174

-

$0.241

$0.200

$0.178

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,393 parts In-Stock

1+ parts

$0.188

100+ parts

-

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2,393

$0.188

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.449

100+ parts

-

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150

$0.449

-

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Flip Electronics

USA . 78,000 parts In-Stock

1+ parts

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78,000

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Vyrian

USA . 3,151 parts In-Stock

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3,151

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Distributors (Availability)

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Ampacity Inc.

Singapore . 38,725 parts In-Stock

1+ parts

$0.168

100+ parts

-

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38,725

$0.168

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-

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Corphita

USA . 2,084 parts In-Stock

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$0.178

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2,084

$0.178

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$0.198

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81

$0.198

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

$0.422

10k+ parts

-

1,000

$0.440

-

$0.422

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Continental Prestige Electronics

USA . 3,597 parts In-Stock

1+ parts

$0.449

100+ parts

-

1k+ parts

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$0.440

3,597

$0.449

-

-

$0.440

Argo Parts USA

USA . 1,192 parts In-Stock

1+ parts

$0.449

100+ parts

-

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$0.435

1,192

$0.449

-

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$0.435

Vigor

Singapore . 551 parts In-Stock

1+ parts

$0.630

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551

$0.630

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AZTECH Wire

Italy . 213 parts In-Stock

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$19.490

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213

$19.490

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Perfect Parts

USA . 78,624 parts In-Stock

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78,624

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QUARKTWIN TECHNOLOGY LTD

USA . 27,243 parts In-Stock

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27,243

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Lixinc

USA . 8,432 parts In-Stock

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8,432

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TANS Electronics

Latvia . 7,529 parts In-Stock

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7,529

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Problanco Electronics

Mexico . 5,970 parts In-Stock

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5,970

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,777 parts In-Stock

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2,777

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Kulean Microsystems

USA . 2,446 parts In-Stock

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2,446

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,710 parts In-Stock

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1,710

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Microchip USA

USA . 363 parts In-Stock

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363

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UHIMA Technologies

Türkiye . 40 parts In-Stock

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40

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Overview

Discover the NCP301HSN30T1G by Onsemi, a high-quality Power Management IC perfect for a wide range of applications. With its small outline and thin profile package, this IC offers maximum performance in a compact design. Ideal for automotive use, this IC boasts a nominal supply voltage of 1.5V and a wide range of power supplies from 0.8V to 10V. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits this product brings to your projects. Upgrade your power management solutions with the NCP301HSN30T1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides excellent insulation and durability, making the product resistant to external environmental factors.

Nominal Supply Voltage (Vsup): 1.5 V

Operating at a nominal supply voltage of 1.5V ensures efficient power management and stability within the specified range.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can function reliably in harsh thermal conditions without compromising performance.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and reliable operation, making it an energy-efficient and dependable choice.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm allows for compact and space-saving PCB design, ideal for applications where size constraints are a concern.

Technical Specifications

Power Management ICs NCP301HSN30T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301HSN30T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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