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NCP300HSN09T1

Onsemi

NCP300HSN09T1 by Onsemi

NCP300HSN09T1 by Onsemi is a Power Management IC with a supply voltage range of 0.8V to 10V, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 °C to 85°C. With CMOS technology and peak reflow temperature of 235°C, it provides power supply support in compact designs.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

6,000

-

$0.238

$0.197

$0.176

Verical

USA . 6,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.220

6,000

-

-

-

$0.220

Distributors (In-Stock)

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Digiode

USA . 667 parts In-Stock

1+ parts

$0.185

100+ parts

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667

$0.185

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Vyrian

USA . 7,404 parts In-Stock

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7,404

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Distributors (Availability)

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Corphita

USA . 2,266 parts In-Stock

1+ parts

$0.176

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-

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2,266

$0.176

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Vigor

Singapore . 578 parts In-Stock

1+ parts

$0.190

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578

$0.190

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Corohmni

South Africa . 471 parts In-Stock

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$0.195

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471

$0.195

-

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Component Stockers USA

USA . 8,283 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

-

8,283

$0.200

$0.190

$0.170

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$13.820

100+ parts

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692

$13.820

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QUARKTWIN TECHNOLOGY LTD

USA . 20,327 parts In-Stock

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Kulean Microsystems

USA . 7,428 parts In-Stock

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7,428

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Microchip USA

USA . 5,814 parts In-Stock

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TANS Electronics

Latvia . 4,534 parts In-Stock

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4,534

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,166 parts In-Stock

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2,166

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SupplyDigital Components

Austria . 1,032 parts In-Stock

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UHIMA Technologies

Türkiye . 147 parts In-Stock

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147

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Overview

Discover the NCP300HSN09T1 by Onsemi, a high-quality Power Management IC designed to provide efficient power supply support in a compact and durable package. With Onsemi's reputation for excellence in technology and innovation, this IC offers exceptional performance and reliability for a wide range of industrial applications. From maintaining optimal voltage levels to ensuring smooth power delivery, this product excels in meeting the demands of today's advanced electronic systems. Experience the value of superior quality and cutting-edge technology with the NCP300HSN09T1 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 0.85 V

Efficiently manages power at a low voltage, helping to conserve energy.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial use.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high efficiency.

Technical Specifications

Power Management ICs NCP300HSN09T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 0.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.7/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.9V

Width (mm):

1.5 mm

Trade Compliance

NCP300HSN09T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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