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NCP2823BFCT2G

Onsemi

NCP2823BFCT2G by Onsemi

NCP2823BFCT2G by Onsemi is an audio amplifier IC with 3W output power, suitable for industrial applications. It operates b/w -40 to 85 °C, with a supply voltage range of 2.5V to 5.5V. This square-shaped package has a very thin profile and fine pitch, making it ideal for surface mount assembly.

Median Price

$0.397

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 302,205 parts In-Stock

1+ parts

-

100+ parts

$0.397

1k+ parts

$0.329

10k+ parts

$0.293

302,205

-

$0.397

$0.329

$0.293

Flip Electronics (Authorized)

USA . 32,306 parts In-Stock

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32,306

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Digiode

USA . 784 parts In-Stock

1+ parts

$0.309

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784

$0.309

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Vyrian

USA . 2,420 parts In-Stock

1+ parts

$0.325

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2,420

$0.325

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Flip Electronics

USA . 38,272 parts In-Stock

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38,272

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Bristol Electronics

USA . 2,400 parts In-Stock

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-

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$0.309

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$0.231

10k+ parts

$0.214

2,400

-

$0.309

$0.231

$0.214

Microfarads

USA . 2,268 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,556 parts In-Stock

1+ parts

$0.292

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1,556

$0.292

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Corohmni

South Africa . 296 parts In-Stock

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$0.325

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296

$0.325

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Vigor

Singapore . 299 parts In-Stock

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$0.830

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299

$0.830

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$3.008

100+ parts

$2.737

1k+ parts

$2.467

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-

2,000

$3.008

$2.737

$2.467

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AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$12.380

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662

$12.380

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A-Z Elektronik GmbH

Germany . 7,103 parts In-Stock

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TANS Electronics

Latvia . 6,025 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 2,128 parts In-Stock

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Problanco Electronics

Mexico . 2,098 parts In-Stock

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SupplyDigital Components

Austria . 1,267 parts In-Stock

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Kulean Microsystems

USA . 842 parts In-Stock

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842

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Microchip USA

USA . 459 parts In-Stock

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459

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UHIMA Technologies

Türkiye . 416 parts In-Stock

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416

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your audio and video experience with the NCP2823BFCT2G by Onsemi! Manufactured with top-quality materials and advanced technology, this audio amplifier offers unparalleled sound performance and reliability. Perfect for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. Upgrade your audio system today with the NCP2823BFCT2G and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the amplifier, making it ideal for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto circuit boards, saving space and simplifies assembly process.

Power Supplies (V): 3/5

Supports multiple power supply options, providing flexibility for different applications and power requirements.

Nominal Output Power: 3 W

Delivers a decent output power of 3W, suitable for various audio applications such as speakers or headphones.

Maximum Operating Temperature: 85 °C

Can operate efficiently in relatively high temperature environments, ensuring stable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperature environments as well, making it suitable for a wide range of operating conditions.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, offering versatility in power input options for the amplifier.

Technical Specifications

Audio & Video Amplifiers NCP2823BFCT2G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B9

JESD-609 Code:

e1

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.45 mm

Trade Compliance

NCP2823BFCT2G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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