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NCN6004AFTBR2G

Onsemi

NCN6004AFTBR2G by Onsemi

The Onsemi NCN6004AFTBR2G is a 48-terminal interface IC with a supply voltage range of 2.7V to 5V, suitable for industrial applications. It features a square package shape, Gull Wing terminal form, and operates in temperatures ranging from -40°C to 85°C. Ideal for surface mount assembly with a thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,924 parts In-Stock

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12,924

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Digiode

USA . 2,261 parts In-Stock

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2,261

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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LIBRA Elektronik GmbH

Germany . 68 parts In-Stock

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68

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,263 parts In-Stock

1+ parts

$7.917

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1,263

$7.917

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AZTECH Wire

Italy . 309 parts In-Stock

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$10.807

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309

$10.807

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Ampacity Inc.

Singapore . 1,642 parts In-Stock

1+ parts

$49.500

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1,642

$49.500

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Component Stockers USA

USA . 614 parts In-Stock

1+ parts

$99.990

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614

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,356 parts In-Stock

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28,356

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Microchip USA

USA . 5,041 parts In-Stock

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5,041

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Kulean Microsystems

USA . 4,786 parts In-Stock

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4,786

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Problanco Electronics

Mexico . 4,624 parts In-Stock

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4,624

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SupplyDigital Components

Austria . 3,337 parts In-Stock

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3,337

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 817 parts In-Stock

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817

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Continental Prestige Electronics

USA . 766 parts In-Stock

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766

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Argo Parts USA

USA . 721 parts In-Stock

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721

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TANS Electronics

Latvia . 361 parts In-Stock

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361

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Corphita

USA . 354 parts In-Stock

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354

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Corohmni

South Africa . 332 parts In-Stock

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332

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Overview

Unlock a world of possibilities with the NCN6004AFTBR2G by Onsemi. Designed with precision and quality in mind, this interface IC offers unparalleled performance and reliability. From industrial applications to consumer electronics, this product is versatile and adaptable to suit your needs. Experience the value and benefits that only Onsemi can deliver, providing you with a seamless solution for all your interface circuit requirements. Elevate your projects with the NCN6004AFTBR2G and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 5 V

Can handle a maximum supply voltage of 5V, making it compatible with a wide range of power sources.

Package Shape: SQUARE

Square package shape provides efficient use of board space and allows for easy placement on the PCB.

No. of Terminals: 48

With 48 terminals, this product offers versatility in connection options and functionality.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles ensures compatibility with different design requirements and thermal management needs.

Minimum Supply Voltage: 2.7 V

Wide range of supply voltage compatibility allows for flexibility in power source selection.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without performance degradation.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring secure connections.

Terminal Position: QUAD

Quad terminal position allows for easy connection to the PCB, simplifying the assembly process.

Maximum Seated Height: 1.1 mm

Low maximum seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 7 mm

Compact width dimension allows for efficient use of board space.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable soldering during manufacturing.

Length: 7 mm

Compact length dimension allows for efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and easy inspection during assembly.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V provides a standard operating voltage for the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density connections and miniaturization of the overall design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the product is suitable for a standard moisture exposure environment.

Interface IC Type: INTERFACE CIRCUIT

Specific interface IC type allows for seamless integration and communication with other components in the system.

Technical Specifications

Other Function Interface ICs NCN6004AFTBR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

NCN6004AFTBR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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