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NCN6001MUTWG

Onsemi

NCN6001MUTWG by Onsemi

NCN6001MUTWG by Onsemi is a 20-terminal interface IC with supply voltage range of 2.7V to 5.5V, operating temperature from -25 °C to 85°C. It features grid array package style, suitable for applications requiring very thin profile and fine pitch connections in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 58,000 parts In-Stock

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Vyrian

USA . 13,132 parts In-Stock

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Digiode

USA . 2,459 parts In-Stock

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AZTECH Wire

Italy . 379 parts In-Stock

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$12.170

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QUARKTWIN TECHNOLOGY LTD

USA . 28,988 parts In-Stock

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Problanco Electronics

Mexico . 7,482 parts In-Stock

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SupplyDigital Components

Austria . 5,610 parts In-Stock

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Corphita

USA . 1,157 parts In-Stock

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Kulean Microsystems

USA . 1,078 parts In-Stock

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TANS Electronics

Latvia . 1,077 parts In-Stock

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Microchip USA

USA . 457 parts In-Stock

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Overview

Enhance your electronic devices with the NCN6001MUTWG by Onsemi, a top-quality interface circuit that offers exceptional performance and reliability. Manufactured by industry leader Onsemi, this product is designed to exceed expectations in various applications. With its versatile design and innovative features, this IC provides customers with unmatched value and benefits. Upgrade your devices today with the NCN6001MUTWG and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a good balance of strength and flexibility, making the product durable and resistant to damage.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can accommodate a range of power sources without risking damage.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, maximizing placement options for other components.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, allowing for versatile input and output configurations.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density mounting, ideal for space-constrained applications where component space is limited.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures compatibility with common power sources, making integration into existing setups seamless.

Technical Specifications

Other Function Interface ICs NCN6001MUTWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e4

Length:

6 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

NCN6001MUTWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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