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NCN6001DTB

Onsemi

NCN6001DTB by Onsemi

NCN6001DTB by Onsemi is a small outline, thin profile interface IC with 20 terminals. It operates b/w -25 to 85 °C and supports supply voltage range of 2.7V to 5.5V. Ideal for applications requiring an interface circuit in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,214 parts In-Stock

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Vyrian

USA . 332 parts In-Stock

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332

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SupplyDigital Components

Austria . 6,880 parts In-Stock

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6,880

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Kulean Microsystems

USA . 5,398 parts In-Stock

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Problanco Electronics

Mexico . 5,345 parts In-Stock

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TANS Electronics

Latvia . 4,926 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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745

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Corphita

USA . 455 parts In-Stock

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Corohmni

South Africa . 271 parts In-Stock

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Overview

Elevate your electronic projects with the NCN6001DTB by Onsemi, a top-of-the-line Other Function Interface IC that promises quality and reliability. Onsemi's reputation for excellence shines through in this product, offering customers cutting-edge technology and seamless integration into a variety of applications. With a sleek design and advanced features, this interface circuit provides unmatched value and benefits to users, making it a must-have component for any project. Experience the difference with Onsemi's NCN6001DTB and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and applications.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to integrate the IC into different circuit layouts and designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C enables reliable performance even in extreme environmental conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connection and ensures secure and stable electrical connections.

Width: 4.4 mm

Compact width of 4.4mm allows for space-efficient placement on the PCB, ideal for small form factor designs.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is common and widely supported, making it easy to integrate this IC into existing systems.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC provides the necessary functionality to connect and communicate between different components in a system.

Technical Specifications

Other Function Interface ICs NCN6001DTB attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NCN6001DTB Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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