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NCN6004AFTBR2

Onsemi

NCN6004AFTBR2 by Onsemi

NCN6004AFTBR2 by Onsemi is a 48-terminal interface IC with supply voltage range of 2.7V to 5V, suitable for industrial applications. It features a square package style, Gull Wing terminal form, and operates b/w -40 °C to 85°C. Ideal for surface mount assembly with a thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,502 parts In-Stock

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Digiode

USA . 1,546 parts In-Stock

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1,546

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Distributors (Availability)

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AZTECH Wire

Italy . 1,177 parts In-Stock

1+ parts

$9.580

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1,177

$9.580

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QUARKTWIN TECHNOLOGY LTD

USA . 7,400 parts In-Stock

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Problanco Electronics

Mexico . 7,028 parts In-Stock

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Microchip USA

USA . 4,823 parts In-Stock

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4,823

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SupplyDigital Components

Austria . 4,404 parts In-Stock

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TANS Electronics

Latvia . 3,856 parts In-Stock

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Kulean Microsystems

USA . 1,204 parts In-Stock

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Corphita

USA . 864 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Overview

Enhance your electronic devices with the cutting-edge technology of the NCN6004AFTBR2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The NCN6004AFTBR2 falls under the category of Other Function Interface ICs, offering seamless integration and enhanced functionality for a wide range of applications. Experience the value and benefits of this product through its superior performance, versatility, and durability. Upgrade your projects with the NCN6004AFTBR2 and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 5 V

Can handle a high supply voltage, providing flexibility in the power source for the product.

Package Shape: SQUARE

Square shape is efficient for component placement and space utilization on the PCB.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options and functionality.

Minimum Supply Voltage: 2.7 V

Can operate at low supply voltages, suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates in extreme cold temperatures, providing reliability in harsh conditions.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy routing of connections on the PCB.

Maximum Seated Height: 1.1 mm

Low profile design saves space and allows for compact product designs.

Width: 7 mm

Compact width dimension makes the product suitable for applications with space constraints.

Peak Reflow Temperature °C: 235

Withstands high reflow temperatures during soldering process, ensuring reliability.

Length: 7 mm

Compact length dimension saves space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in various environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance in the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand standard moisture exposure during storage and operation.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, ensuring optimal performance and functionality.

Technical Specifications

Other Function Interface ICs NCN6004AFTBR2 attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

NCN6004AFTBR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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