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NCN6001MUR2G

Onsemi

NCN6001MUR2G by Onsemi

The Onsemi NCN6001MUR2G is a 20-terminal interface IC with a supply voltage range of 2.7V to 5.5V, suitable for applications requiring an interface circuit with a temperature range of -25 °C to 85°C. This chip carrier package has a rectangular shape, surface mountable design, and terminal finish in nickel palladium gold for reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 780 parts In-Stock

1+ parts

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780

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Digiode

USA . 688 parts In-Stock

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688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,766 parts In-Stock

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7,766

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Kulean Microsystems

USA . 3,451 parts In-Stock

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3,451

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Problanco Electronics

Mexico . 2,210 parts In-Stock

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2,210

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Corphita

USA . 1,331 parts In-Stock

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1,331

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TANS Electronics

Latvia . 752 parts In-Stock

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752

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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666

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Corohmni

South Africa . 134 parts In-Stock

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134

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Overview

Boost your electronic designs with the NCN6001MUR2G by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge products that exceed industry standards. The NCN6001MUR2G falls under the category of Other Function Interface ICs, offering versatile applications in various electronic devices. With a wide supply voltage range, compact chip carrier package style, and superior terminal finish, this interface circuit provides unmatched value and performance to customers looking to elevate their projects to the next level. Elevate your designs with Onsemi's NCN6001MUR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making this product ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can safely operate in a wide range of electrical systems.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design for easy integration into electronic devices.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, making this product suitable for various interfacing tasks.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal and electrical performance, ensuring optimal functionality of the IC.

Minimum Supply Voltage: 2.7 V

The minimum supply voltage of 2.7V ensures reliable operation even in low-power applications, increasing the product's versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can function efficiently in a wide range of environmental conditions.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C allows for use in various temperature extremes, enhancing product reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly, making this product user-friendly for electronics manufacturers.

Maximum Seated Height: 0.6 mm

With a maximum seated height of 0.6mm, this product offers a low profile design, ideal for slim and compact electronic devices.

Width: 5 mm

The width of 5mm provides a compact form factor, making this product suitable for applications where space is limited.

Length: 6 mm

The length of 6mm offers a balanced shape for easy integration into electronic designs, ensuring a seamless fit.

Terminal Form: BUTT

The butt terminal form simplifies the connection process, making it easy to insert and solder terminals during assembly.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this product is compatible with standard voltage levels, making it easy to integrate into existing electronic systems.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm provides sufficient spacing for easy soldering and assembly, ensuring reliable connections.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC type, this product facilitates communication between different components or systems, making it essential for seamless data exchange.

Technical Specifications

Other Function Interface ICs NCN6001MUR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PBCC-B20

JESD-609 Code:

e4

Length:

6 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

NCN6001MUR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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