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MTB52N06VLT4G

Onsemi

MTB52N06VLT4G by Onsemi

MTB52N06VLT4G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 182A IDM, and 0.025 ohm RDS(on). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation. Package: PLASTIC/EPOXY, GULL WING terminals, suitable for surface mount.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,174 parts In-Stock

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Digiode

USA . 1,037 parts In-Stock

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Kulean Microsystems

USA . 7,991 parts In-Stock

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TANS Electronics

Latvia . 7,155 parts In-Stock

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SupplyDigital Components

Austria . 6,023 parts In-Stock

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Problanco Electronics

Mexico . 2,296 parts In-Stock

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Corphita

USA . 366 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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Overview

Power up your applications with the MTB52N06VLT4G by Onsemi! This high-quality Power FET offers reliable performance in a variety of switching applications. With its N-channel configuration and built-in diode, this transistor is perfect for enhancing mode operation. Whether you're looking to boost efficiency, increase power output, or improve overall performance, the MTB52N06VLT4G delivers the value and benefits you need. Trust Onsemi's expertise and innovation to take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET and efficient switching performance, making it ideal for applications requiring precise control.

Maximum Pulsed Drain Current (IDM): 182 A

High maximum pulsed drain current rating of 182A allows the FET to handle large current spikes, making it suitable for applications with high power requirements.

Avalanche Energy Rating (EAS): 406 mJ

High avalanche energy rating of 406mJ ensures reliable operation under surge conditions, making the FET a robust choice for demanding applications.

Maximum Drain Current (ID): 52 A

High maximum drain current rating of 52A enables the FET to handle large continuous currents, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.025 ohm

Low drain-source on resistance of 0.025 ohm reduces power dissipation and improves efficiency, making the FET an energy-efficient choice for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MTB52N06VLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

406 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

182 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB52N06VLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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