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MTB50N06VT4

Onsemi

MTB50N06VT4 by Onsemi

MTB50N06VT4 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 147A and EAS of 400mJ, operating in ENHANCEMENT MODE. With a Drain Current of 42A and 0.028 ohm On Resistance, this transistor offers high performance in a small outline package.

Median Price

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Digiode

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Lantek

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Vyrian

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ComSIT Distribution GmbH

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PC Components Company LLC

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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TANS Electronics

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GreenTree Electronics

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UHIMA Technologies

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Corohmni

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Overview

Upgrade your power systems with the MTB50N06VT4 by Onsemi. As a leading manufacturer of Power Field Effect Transistors, Onsemi delivers high-quality products that are perfect for various applications such as switching. With a maximum operating temperature of 175 °C and a maximum drain current of 42A, this N-CHANNEL transistor offers superior performance and reliability. Say goodbye to power system inefficiencies and hello to enhanced functionality with the MTB50N06VT4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, making it ideal for long-term use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON resistance and higher electron mobility, resulting in improved performance and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient reverse current protection, enhancing the overall reliability of the FET in different operating conditions.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast operation and low power dissipation, making it suitable for a wide range of switching tasks.

Surface Mount: YES

Surface mount technology simplifies the installation process and allows for compact and space-saving designs, making this FET suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET can handle higher voltage levels, making it suitable for applications that require robust and reliable performance.

Maximum Pulsed Drain Current (IDM): 147 A

The high pulsed drain current rating enables this FET to handle momentary high current spikes, making it suitable for high-power applications that require reliable performance under load.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation rating allows this FET to handle high power levels without overheating, ensuring long-term reliability in demanding applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high-temperature environments, making it suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.028 ohm

The low ON resistance of this FET results in minimal power loss and improved efficiency, making it ideal for applications where low power dissipation is critical.

Technical Specifications

Power Field Effect Transistors (FET) MTB50N06VT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

147 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB50N06VT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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