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MMBFU310LT1

Onsemi

MMBFU310LT1 by Onsemi

Onsemi's MMBFU310LT1 is an N-CHANNEL RF FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. Operating in DEPLETION MODE, it offers Ultra High Frequency Band performance and a max power dissipation of 0.225W. With GULL WING terminals and a SMALL OUTLINE package style, it can withstand temperatures up to 150 °C.

Median Price

$0.268

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2,970 parts In-Stock

1+ parts

$0.157

100+ parts

$0.164

1k+ parts

$0.155

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2,970

$0.157

$0.164

$0.155

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Component Electronics Inc.

Canada . 2,900 parts In-Stock

1+ parts

$0.380

100+ parts

$0.290

1k+ parts

$0.250

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2,900

$0.380

$0.290

$0.250

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Chip Stock

USA . 36,500 parts In-Stock

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36,500

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A2Z Electronics, Inc.

USA . 9,646 parts In-Stock

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9,646

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J2 Sourcing AB

Sweden . 4,218 parts In-Stock

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4,218

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Semi Source

USA . 3,395 parts In-Stock

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3,395

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R&J Components

USA . 3,000 parts In-Stock

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Electro Mavin

USA . 2,940 parts In-Stock

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2,940

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Fibra_Brandt Electronic GMBH

Germany . 1,500 parts In-Stock

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1,500

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Vyrian

USA . 1,058 parts In-Stock

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1,058

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Mil-Aero Solutions, Inc.

USA . 358 parts In-Stock

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358

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Resion

USA . 340 parts In-Stock

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340

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Digiode

USA . 243 parts In-Stock

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243

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Distributors (Availability)

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Corohmni

South Africa . 375 parts In-Stock

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$0.157

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375

$0.157

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Component Stockers USA

USA . 302 parts In-Stock

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$99.990

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302

$99.990

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Problanco Electronics

Mexico . 4,678 parts In-Stock

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Kulean Microsystems

USA . 4,447 parts In-Stock

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TANS Electronics

Latvia . 4,224 parts In-Stock

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Assy Fe

Spain . 2,273 parts In-Stock

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Corphita

USA . 1,867 parts In-Stock

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1,867

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SupplyDigital Components

Austria . 1,632 parts In-Stock

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1,632

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Kepictronics

USA . 1,333 parts In-Stock

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Elevate your amplifier performance with the MMBFU310LT1 by Onsemi, a top-tier RF Small Signal Field Effect Transistor that guarantees unparalleled quality and reliability. Designed for ultra-high frequency applications, this N-CHANNEL transistor offers superior power dissipation and breakthrough technology for optimal signal amplification. With its sleek GULL WING terminals and robust SILICON element material, this transistor is a game-changer in the industry. Trust Onsemi to deliver cutting-edge solutions that redefine excellence in electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity, making them efficient for many applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easy to use in various amplifier setups.

Transistor Application: AMPLIFIER

Specifically designed for amplification applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and enabling efficient assembly.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, it can handle higher voltages without damage, ensuring reliability.

Maximum Power Dissipation (Abs): 0.225 W

Can dissipate up to 0.225W of power without overheating, enabling stable operation under varying loads.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures up to 150 °C, suitable for applications with elevated thermal conditions.

Maximum Feedback Capacitance (Crss): 2.5 pF

Low feedback capacitance contributes to high-frequency stability and minimal signal distortion in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBFU310LT1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBFU310LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-408-6877, 5961014086877

NIIN

014086877

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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