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MJD44H11-001

Onsemi

MJD44H11-001 by Onsemi

Onsemi's MJD44H11-001 is a NPN BJT transistor with 80V VCE, 8A IC, and 20W Pd. Ideal for switching applications, it has hFE of 40, operates up to 150 °C, and features SILICON element material. Suitable for various power electronics projects requiring high-speed performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Maverick Electronics, Inc.

USA . 8,625 parts In-Stock

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Vyrian

USA . 4,067 parts In-Stock

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Digiode

USA . 1,461 parts In-Stock

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AZTECH Wire

Italy . 991 parts In-Stock

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$13.990

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Component Stockers USA

USA . 534 parts In-Stock

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$99.990

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534

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,503 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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SupplyDigital Components

Austria . 7,991 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,010 parts In-Stock

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Kulean Microsystems

USA . 3,564 parts In-Stock

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Problanco Electronics

Mexico . 2,955 parts In-Stock

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TANS Electronics

Latvia . 1,362 parts In-Stock

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Corphita

USA . 1,100 parts In-Stock

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Corohmni

South Africa . 328 parts In-Stock

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UHIMA Technologies

Türkiye . 172 parts In-Stock

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Overview

Looking for a reliable and efficient power solution? Look no further than the MJD44H11-001 by Onsemi. With a reputation for quality and innovation, Onsemi delivers top-notch Power Bipolar Junction Transistors (BJT) like this one, perfect for various switching applications. Offering a maximum collector current of 8A and a minimum DC current gain of 40, this NPN transistor provides exceptional performance and reliability. Trust Onsemi to provide you with the best technology for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching applications, providing versatility in usage.

Configuration: SINGLE

Simplifies circuit design as only one transistor is needed for operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance.

Maximum Power Dissipation (Abs): 20 W

Can handle higher power levels without overheating, making it suitable for demanding tasks.

Maximum Collector-Emitter Voltage: 80 V

With a high voltage rating, this transistor can be used in a wide range of applications.

Maximum Collector Current (IC): 8 A

Capable of handling high currents, making it suitable for power electronics applications.

Nominal Transition Frequency (fT): 85 MHz

Provides high frequency response, making it suitable for RF applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD44H11-001 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

80 V

Configuration:

Minimum DC Current Gain (hFE):

40

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJD44H11-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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