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MJ21196G

Onsemi

MJ21196G by Onsemi

MJ21196G by Onsemi is a NPN BJT with 250V VCE, 16A IC, and 250W Ptot. Ideal for amplifier applications due to its high power dissipation, low hFE of 8, and operating temperature up to 200°C. The transistor's silicon element and flange mount package make it suitable for high-power amplification needs.

Median Price

$7.504

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,101 parts In-Stock

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$9.070

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$9.070

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Newark

USA . 100 parts In-Stock

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$9.130

100+ parts

$4.820

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100

$9.130

$4.820

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DigiKey

USA . 1,327 parts In-Stock

1+ parts

$9.240

100+ parts

$4.685

1k+ parts

$4.144

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1,327

$9.240

$4.685

$4.144

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$210.180

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20

$210.180

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Rochester

USA . 6,507 parts In-Stock

1+ parts

-

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$4.140

1k+ parts

$3.710

10k+ parts

$3.490

6,507

-

$4.140

$3.710

$3.490

Verical

USA . 3,402 parts In-Stock

1+ parts

-

100+ parts

$5.175

1k+ parts

$4.638

10k+ parts

$4.362

3,402

-

$5.175

$4.638

$4.362

Flip Electronics (Authorized)

USA . 2,900 parts In-Stock

1+ parts

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2,900

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Master Electronics

USA . 401 parts In-Stock

1+ parts

-

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$4.250

1k+ parts

$4.020

10k+ parts

$3.980

401

-

$4.250

$4.020

$3.980

RS (Exports)

UK . 110 parts In-Stock

1+ parts

-

100+ parts

$5.939

1k+ parts

$4.705

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110

-

$5.939

$4.705

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EBV Elektronik

Germany . 100 parts In-Stock

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100

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Digiode

USA . 812 parts In-Stock

1+ parts

$4.370

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812

$4.370

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.637

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10

$4.637

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TME

Poland . 66 parts In-Stock

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$8.350

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66

$8.350

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Chip Stock

USA . 14,820 parts In-Stock

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14,820

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Vyrian

USA . 4,862 parts In-Stock

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4,862

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Flip Electronics

USA . 2,900 parts In-Stock

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2,900

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IBS Electronics

USA . 401 parts In-Stock

1+ parts

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100+ parts

$5.961

1k+ parts

$5.638

10k+ parts

$5.582

401

-

$5.961

$5.638

$5.582

NAC Semi

USA . 100 parts In-Stock

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$10.930

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100

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$10.930

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ComSIT Distribution GmbH

Germany . 84 parts In-Stock

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84

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ComSIT USA

USA . 84 parts In-Stock

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84

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Schukat

Germany . 10 parts In-Stock

1+ parts

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100+ parts

$6.044

1k+ parts

$5.179

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10

-

$6.044

$5.179

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,460 parts In-Stock

1+ parts

$3.580

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4,460

$3.580

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Corphita

USA . 1,706 parts In-Stock

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$4.140

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1,706

$4.140

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Corohmni

South Africa . 70 parts In-Stock

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$4.150

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70

$4.150

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Component Stockers USA

USA . 36,367 parts In-Stock

1+ parts

$5.020

100+ parts

$4.710

1k+ parts

$4.260

10k+ parts

$4.260

36,367

$5.020

$4.710

$4.260

$4.260

Microchip USA

USA . 2,970 parts In-Stock

1+ parts

$28.730

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$28.730

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QUARKTWIN TECHNOLOGY LTD

USA . 24,376 parts In-Stock

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Continental Prestige Electronics

USA . 22,379 parts In-Stock

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Lixinc

USA . 19,669 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 7,524 parts In-Stock

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7,524

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A-Z Elektronik GmbH

Germany . 6,812 parts In-Stock

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Argo Parts USA

USA . 3,972 parts In-Stock

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3,972

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Kulean Microsystems

USA . 1,764 parts In-Stock

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1,764

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SupplyDigital Components

Austria . 1,338 parts In-Stock

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Perfect Parts

USA . 1,313 parts In-Stock

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1,313

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TANS Electronics

Latvia . 702 parts In-Stock

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702

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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557

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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Overview

Unleash the power of innovation with the MJ21196G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unrivaled quality and reliability in their Power Bipolar Junction Transistors (BJT). With applications in amplifiers, this NPN transistor offers a maximum power dissipation of 250W and a collector current of 16A, providing exceptional performance for your projects. Experience the value and benefits of Onsemi's MJ21196G in your next design, setting new standards in efficiency and power delivery.

Feature Benefit Bullets

Package Body Material:

This makes the product durable and ensures better heat dissipation.

Polarity or Channel Type:

The NPN configuration allows for easy integration into various amplifier circuits.

Configuration:

The single configuration simplifies circuit design and operation.

Transistor Application:

Specifically designed for amplification applications, ensuring optimal performance.

Package Shape:

The round shape allows for efficient placement and mounting in circuit designs.

Terminal Form:

The pin/peg terminals provide a secure and reliable connection.

No. of Terminals:

Having 2 terminals simplifies installation and reduces chances of errors.

Maximum Power Dissipation (Abs):

With a high power dissipation, this transistor can handle large loads effectively.

Package Style (Meter):

The flange mount style offers easy installation and secure mounting.

Minimum DC Current Gain (hFE):

A minimum DC current gain of 8 ensures consistent amplification performance.

Maximum Operating Temperature:

The high maximum operating temperature allows for reliable performance under various conditions.

Maximum Collector-Emitter Voltage:

The high maximum voltage rating ensures safety and reliability in high voltage applications.

Transistor Element Material:

The silicon material offers good performance characteristics and reliability.

Maximum Collector Current (IC):

With a high collector current, this transistor can handle large current loads.

Terminal Finish:

The matte tin finish provides good conductivity and corrosion resistance.

Terminal Position:

The bottom terminal position allows for easy integration and connection in circuits.

Case Connection:

The case connection at the collector ensures a stable and reliable connection.

Nominal Transition Frequency (fT):

The high nominal transition frequency allows for high-speed switching and performance.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ21196G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

250 V

Configuration:

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJ21196G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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