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MJ21193

Onsemi

MJ21193 by Onsemi

MJ21193 by Onsemi is a PNP BJT transistor with 250V VCE, 16A IC, and 250W power dissipation. Ideal for amplifier applications due to its single configuration and high transition frequency of 4MHz. Package style is flange mount with round shape and metal body material.

Median Price

$8.781

Lifecycle Status

Suppliers In-Stock

8

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1k+

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Master Electronics

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Bristol Electronics

USA . 11,382 parts In-Stock

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$8.781

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$3.805

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$3.600

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Vyrian

USA . 7,116 parts In-Stock

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Digiode

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Carlin Systems, Inc.

USA . 800 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Donberg Electronics Ltd

Ireland . 2 parts In-Stock

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TANS Electronics

Latvia . 8,220 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,866 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 585 parts In-Stock

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Overview

Unlock the power of amplification with the MJ21193 Power Bipolar Junction Transistor by Onsemi. Known for their exceptional quality and reliability, Onsemi delivers top-notch products that meet the highest industry standards. Ideal for amplifier applications, this PNP transistor offers a maximum power dissipation of 250W and a collector current of 16A. With a minimum DC current gain of 8 and a maximum operating temperature of 200°C, the MJ21193 provides unmatched performance and durability. Experience seamless functionality and superior results with the MJ21193 from Onsemi.

Feature Benefit Bullets

Package Body Material: METAL

Metal package provides good heat dissipation, making the transistor ideal for high power applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplification circuits.

Terminal Form: PIN/PEG

Pin/peg terminals provide easy and secure connections in circuits.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability allows the transistor to handle large amounts of power without overheating.

Maximum Collector-Emitter Voltage: 250 V

High collector-emitter voltage rating enables the transistor to be used in high voltage applications.

Maximum Collector Current (IC): 16 A

High collector current rating allows the transistor to handle large current loads.

Nominal Transition Frequency (fT): 4 MHz

High transition frequency indicates fast switching speeds, making the transistor suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ21193 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

250 V

Configuration:

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJ21193 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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