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MDC3238T3

Onsemi

MDC3238T3 by Onsemi

MDC3238T3 by Onsemi is a Peripheral Driver with 6 terminals, operating b/w -55 to 150 °C. It has a supply voltage range of 0.9V to 1.7V and can handle a max current of 200mA. Ideal for applications requiring BUFFER OR INVERTER BASED PERIPHERAL DRIVER technology in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,166 parts In-Stock

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1,166

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Digiode

USA . 1,080 parts In-Stock

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1,080

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,089 parts In-Stock

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6,089

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Kulean Microsystems

USA . 5,419 parts In-Stock

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5,419

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TANS Electronics

Latvia . 4,051 parts In-Stock

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4,051

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SupplyDigital Components

Austria . 2,327 parts In-Stock

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2,327

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Corphita

USA . 1,917 parts In-Stock

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1,917

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UHIMA Technologies

Türkiye . 699 parts In-Stock

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699

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Corohmni

South Africa . 270 parts In-Stock

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270

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Overview

Discover the MDC3238T3 by Onsemi, a top-quality peripheral driver designed for various applications. With a focus on performance and reliability, Onsemi is known for producing innovative solutions that exceed industry standards. This product offers customers exceptional value with its features like easy installation and efficient operation. Whether you're looking to enhance your electronic devices or streamline your manufacturing process, the MDC3238T3 is the perfect choice. Upgrade your systems with this versatile and dependable peripheral driver today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Surface mount design allows for easy and convenient installation onto circuit boards.

Maximum Supply Voltage: 1.7 V

Ability to handle high supply voltages makes this peripheral driver suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape enables space-efficient placement on circuit boards.

No. of Terminals: 6

Sufficient number of terminals for connecting to other circuit components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small outline and thin profile make this peripheral driver ideal for compact electronic devices.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage requirement allows for efficient power consumption.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for use in both hot and cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connection options.

Maximum Seated Height: 1.1 mm

Low profile design with maximum seated height of 1.1 mm saves space in compact electronic devices.

Width: 1.25 mm

Narrow width of 1.25 mm allows for placement in tight spaces on circuit boards.

Length: 2 mm

Compact length of 2 mm further enhances space-saving attributes of this peripheral driver.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and reliable performance in signal processing applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure attachment to circuit boards.

Maximum Supply Current: 200 mA

Ability to handle high supply currents ensures stable operation under varying load conditions.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm enables high-density mounting on circuit boards.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type provides signal amplification or inversion capabilities for versatile integration into electronic systems.

Output Current Flow Direction: SINK

Sink output current flow direction allows for driving various loads and interfacing with different circuit components.

Technical Specifications

Peripheral Drivers MDC3238T3 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MDC3238T3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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