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MDC3237T3

Onsemi

MDC3237T3 by Onsemi

MDC3237T3 by Onsemi is a small outline, thin profile peripheral driver with 6 terminals. It operates b/w -55 to 150 °C and has a max supply voltage of 1.7 V. Ideal for applications requiring buffer or inverter based peripheral drivers with sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,093 parts In-Stock

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Vyrian

USA . 596 parts In-Stock

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Kulean Microsystems

USA . 6,861 parts In-Stock

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Problanco Electronics

Mexico . 5,619 parts In-Stock

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SupplyDigital Components

Austria . 4,834 parts In-Stock

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TANS Electronics

Latvia . 4,028 parts In-Stock

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Corphita

USA . 2,146 parts In-Stock

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UHIMA Technologies

Türkiye . 926 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Enhance your electronic designs with the MDC3237T3 by Onsemi, a top-quality peripheral driver that offers unparalleled performance and reliability. Manufactured by Onsemi, a renowned industry leader, this innovative product is designed to meet the needs of various applications with its advanced technology and superior design. From ensuring smooth signal transmission to providing efficient power management, the MDC3237T3 delivers exceptional value and benefits to customers seeking cutting-edge solutions for their projects. Experience the advantages of this high-quality product today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 1.7 V

Can handle higher voltage inputs, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Standard shape that fits well in typical electronic circuits.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Low profile design saves space and allows for compact product designs.

Minimum Supply Voltage: 0.9 V

Supports low voltage operation, suitable for energy-efficient applications.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -55 °C

Capable of operating in very low temperatures, ensuring reliability in harsh conditions.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal layout allows for flexible wiring configurations.

Maximum Seated Height: 1.1 mm

Low profile height saves space and enables compact product designs.

Width: 1.25 mm

Compact width for easy integration into various electronic systems.

Length: 2 mm

Standard length that fits well in typical electronic circuits.

Technology: BIPOLAR

Reliable bipolar technology for stable performance and compatibility with different systems.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections on PCBs.

Maximum Supply Current: 200 mA

Capable of handling moderate current levels, suitable for various applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for compact design and efficient use of PCB space.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type that can be used for buffering or inverting signals in peripheral driver applications.

Output Current Flow Direction: SINK

Sink output current flow direction for compatibility with specific circuit requirements.

Technical Specifications

Peripheral Drivers MDC3237T3 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MDC3237T3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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