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MDC3105XV6T1G

Onsemi

MDC3105XV6T1G by Onsemi

MDC3105XV6T1G by Onsemi is a 6-terminal peripheral driver with max output current of 0.25A. It operates b/w -40 to 85 °C, suitable for industrial applications. This bipolar technology IC has a nominal voltage of 5V and is designed for sink current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,404 parts In-Stock

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Digiode

USA . 431 parts In-Stock

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431

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Problanco Electronics

Mexico . 8,108 parts In-Stock

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8,108

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TANS Electronics

Latvia . 7,720 parts In-Stock

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7,720

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Kulean Microsystems

USA . 6,323 parts In-Stock

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SupplyDigital Components

Austria . 3,106 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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345

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Corphita

USA . 290 parts In-Stock

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290

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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Overview

Boost your peripheral driver performance with the MDC3105XV6T1G by Onsemi. Designed for industrial-grade applications, this small outline package delivers reliable power supplies and output current flow direction for optimal performance. With a focus on quality and durability, Onsemi's reputation as a trusted manufacturer ensures that you are getting a product that will exceed your expectations. Ideal for a wide range of applications, this peripheral driver offers exceptional value and benefits, making it the perfect choice for your next project. Trust Onsemi to deliver the reliability and performance you need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making the product suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and improving the overall design efficiency.

Power Supplies (V): 5

Operating at a voltage of 5V makes this product compatible with a wide range of systems and devices, offering flexibility in application.

Maximum Output Current: 0.25 A

Having a maximum output current of 0.25A ensures that the product can efficiently drive peripheral devices without overloading, ensuring reliable performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows the product to operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver provides versatility in driving various types of peripherals, making the product compatible with a wide range of devices.

Technical Specifications

Peripheral Drivers MDC3105XV6T1G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-F6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DFP

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

MDC3105XV6T1G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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