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MDC3238T1

Onsemi

MDC3238T1 by Onsemi

The Onsemi MDC3238T1 is a small outline, thin profile peripheral driver with 6 terminals. It operates b/w -55 to 150 °C and has a max supply voltage of 1.7 V. Ideal for applications requiring sink output current flow direction and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,205 parts In-Stock

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Vyrian

USA . 147 parts In-Stock

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147

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SupplyDigital Components

Austria . 6,549 parts In-Stock

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6,549

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Kulean Microsystems

USA . 5,380 parts In-Stock

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TANS Electronics

Latvia . 4,935 parts In-Stock

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Problanco Electronics

Mexico . 1,618 parts In-Stock

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Corphita

USA . 744 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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Corohmni

South Africa . 347 parts In-Stock

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Overview

Discover the MDC3238T1 by Onsemi, a high-quality peripheral driver designed to enhance your electronic projects. With a reputation for excellence, Onsemi delivers reliable products that meet industry standards. Perfect for a variety of applications, this compact and versatile device offers impressive value and benefits to customers. From its small outline to its high operating temperature range, the MDC3238T1 is a must-have for those seeking top-notch performance in their designs. Experience the difference with Onsemi's innovative technology and trust in the reliability of a leading manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

The ability to be surface mounted allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.7 V

The high maximum supply voltage allows for compatibility with a variety of systems and ensures reliable performance under different operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space and easy placement within electronic devices.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and enables the product to interface with multiple components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design make this product ideal for compact devices where space is limited.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage ensures energy efficiency and extends the product's usability in low-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand elevated heat levels and operate reliably in various environments.

Minimum Operating Temperature: -55 °C

The ability to operate at extremely low temperatures makes this product suitable for use in harsh or cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and corrosion resistance, enhancing the product's overall performance and longevity.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connections, allowing for customized configurations in different setups.

Maximum Seated Height: 1.1 mm

The low maximum seated height enables a compact design and easy integration into tight spaces or thin electronic devices.

Width: 1.25 mm

The narrow width of the product allows for efficient use of space on circuit boards and in electronic assemblies.

Length: 2 mm

The short length of the product contributes to its compact design and suitability for small electronic devices.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and precise signal control, making this product reliable for driving peripheral devices.

Terminal Form: GULL WING

The gull wing terminal form is conducive to automated assembly processes, improving efficiency and reducing manufacturing costs.

Maximum Supply Current: 200 mA

The high maximum supply current allows the product to drive demanding peripherals or multiple components simultaneously without performance degradation.

Terminal Pitch: 0.65 mm

The small terminal pitch provides high-density connectivity and facilitates precise placement on circuit boards for optimized performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type offers signal buffering or inversion capabilities, enhancing the product's compatibility with a wide range of peripherals and communication protocols.

Output Current Flow Direction: SINK

The sink output current flow direction allows the product to effectively control and regulate the flow of current to connected peripherals, ensuring stable and safe operation.

Technical Specifications

Peripheral Drivers MDC3238T1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MDC3238T1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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