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MDC3237T1

Onsemi

MDC3237T1 by Onsemi

MDC3237T1 by Onsemi is a small outline, thin profile peripheral driver with 6 terminals. It operates b/w -55 to 150 °C and has a max supply voltage of 1.7 V. Ideal for applications requiring sink output current flow direction in a compact form factor.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

3,000

-

$0.132

$0.110

$0.098

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.170

3,000

-

-

-

$0.170

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.122

3,000

-

-

-

$0.122

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,205 parts In-Stock

1+ parts

$0.103

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

$0.103

-

-

-

Vyrian

USA . 670 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$0.108

-

-

-

DigiKey Marketplace

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,131 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

10k+ parts

-

1,131

$0.097

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$0.108

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,259

-

-

-

-

SupplyDigital Components

Austria . 7,424 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,424

-

-

-

-

TANS Electronics

Latvia . 7,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,380

-

-

-

-

Problanco Electronics

Mexico . 6,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,100

-

-

-

-

Kulean Microsystems

USA . 5,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,536

-

-

-

-

UHIMA Technologies

Türkiye . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6

-

-

-

-

Overview

Experience unparalleled quality and reliability with the MDC3237T1 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and durability in their products. The MDC3237T1 falls under the category of Peripheral Drivers, offering a wide range of applications for various electronic devices. With a compact design and advanced technology, this product provides customers with exceptional value, benefits, and advantages. Upgrade your electronic projects with the MDC3237T1 and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.7 V

Can handle a broad range of input voltages, offering flexibility in usage.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stability under various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range allows for reliable operation in extreme cold temperatures.

Terminal Finish: TIN LEAD

Tin lead finish provides strong and reliable electrical connections.

Width: 1.25 mm

Slim width saves space on the PCB.

Length: 2 mm

Compact length allows for efficient placement on the PCB.

Technology: BIPOLAR

Bipolar technology offers high speed and precision in signal processing.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and stability during installation.

Maximum Supply Current: 200 mA

Can handle high current loads, making it suitable for a variety of applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB.

Output Current Flow Direction: SINK

Sink output current flow direction is suitable for driving external loads such as LEDs or relays.

Technical Specifications

Peripheral Drivers MDC3237T1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MDC3237T1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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