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MC74VHCT139AMG

Onsemi

MC74VHCT139AMG by Onsemi

MC74VHCT139AMG by Onsemi is a CMOS Decoder & Drivers with 10.5ns Propagation Delay, 16.5ns tpd, and 8A Max I (ol). It operates at -55 to 125 °C and has a package style of SMALL OUTLINE. Ideal for military-grade applications requiring fast signal decoding.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,606 parts In-Stock

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Digiode

USA . 465 parts In-Stock

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AZTECH Wire

Italy . 530 parts In-Stock

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$8.810

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Component Stockers USA

USA . 278 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 5,965 parts In-Stock

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TANS Electronics

Latvia . 3,306 parts In-Stock

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Problanco Electronics

Mexico . 2,955 parts In-Stock

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Corphita

USA . 2,130 parts In-Stock

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Kulean Microsystems

USA . 1,582 parts In-Stock

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UHIMA Technologies

Türkiye . 864 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 119 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the MC74VHCT139AMG decoder & drivers by Onsemi. With a focus on innovation and cutting-edge technology, Onsemi delivers superior products that exceed industry standards. Ideal for a wide range of applications, this product provides fast propagation delay and precise output control. Experience the value and benefits of this product with its high performance and efficiency, making it a top choice for customers seeking top-tier solutions in the electronics industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast response times, making this decoder & driver efficient in time-sensitive operations.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and time during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, ideal for fitting in tight spaces or crowded PCB layouts.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with most electronic systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder & driver can withstand harsh environmental conditions or extended use without overheating.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, ensuring reliable performance and energy efficiency.

Technical Specifications

Decoder & Drivers MC74VHCT139AMG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHCT/VHCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74VHCT139AMG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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