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MC74LVX257D

Onsemi

MC74LVX257D by Onsemi

MC74LVX257D by Onsemi is a 4-function, 2-input multiplexer with 13.5ns propagation delay at 3.3V supply voltage. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style for surface mount applications. With true output polarity and 3-state characteristics, it's ideal for various digital logic designs.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Digiode

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R&J Components

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AZTECH Wire

Italy . 697 parts In-Stock

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Component Stockers USA

USA . 531 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 10,338 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 3,508 parts In-Stock

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TANS Electronics

Latvia . 3,287 parts In-Stock

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SupplyDigital Components

Austria . 2,566 parts In-Stock

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 406 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the MC74LVX257D by Onsemi. Crafted with precision and quality, this multiplexer & demultiplexer offers superior performance in a compact package. Perfect for industrial applications, this product ensures efficient signal routing with minimal propagation delay. Trust in Onsemi's expertise to deliver cutting-edge technology for your electronic needs. Upgrade your systems today with the MC74LVX257D and enjoy unparalleled value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for the product.

Propagation Delay At Nominal Supply: 13.5 ns

Low propagation delay ensures fast signal processing and reduces latency.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on PCBs.

No. of Functions: 4

Multiple functions provided in a single device offer efficiency and space savings in circuit design.

No. of Inputs: 2

Having multiple inputs allows for versatile signal routing and processing.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and mounting options.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage for efficient performance of the device.

Load Capacitance (CL): 50 pF

Suitable load capacitance for effective signal processing and transmission.

Power Supplies (V): 3.3

Compatible with standard power supplies for easy integration into existing systems.

No. of Terminals: 16

Sufficient terminals for connecting inputs, outputs, and power supply.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB and allows for compact circuit designs.

Maximum I (ol): 4 Amp

High output current capability for driving loads efficiently.

Propagation Delay (tpd): 18.5 ns

Low propagation delay ensures fast signal processing and reduces latency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in harsh environments.

Terminal Finish: TIN LEAD

Tin lead finish for easy soldering and reliable connection.

Terminal Position: DUAL

Dual terminal position for versatile mounting options.

Maximum Seated Height: 1.75 mm

Low seated height for minimal space requirement on the PCB.

Width: 3.9 mm

Compact width for space-efficient circuit design.

Output Polarity: TRUE

True output polarity ensures correct signal transmission.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage for efficient power consumption.

Peak Reflow Temperature °C: 235

High peak reflow temperature for reliable soldering during assembly.

Length: 9.9 mm

Optimal length for accommodating multiple terminals and components.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for robust performance in harsh environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and mechanical stability.

Packing Method: RAIL

Rail packing method for easy handling and storage of multiple devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage for flexibility in power supply options.

Technical Specifications

Multiplexer & Demultiplexer MC74LVX257D attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74LVX257D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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