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MC74LCX574MEL

Onsemi

MC74LCX574MEL by Onsemi

MC74LCX574MEL by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a max frequency of 150MHz, with propagation delay of 9.5ns at Vsup of 3.3V. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,150 parts In-Stock

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Digiode

USA . 1,302 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 93 parts In-Stock

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$20.860

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93

$20.860

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Problanco Electronics

Mexico . 8,002 parts In-Stock

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Kulean Microsystems

USA . 5,841 parts In-Stock

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Corphita

USA . 2,483 parts In-Stock

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SupplyDigital Components

Austria . 2,474 parts In-Stock

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TANS Electronics

Latvia . 2,456 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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883

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Microchip USA

USA . 432 parts In-Stock

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Corohmni

South Africa . 378 parts In-Stock

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Overview

Enhance your electronic designs with the MC74LCX574MEL by Onsemi, a leading manufacturer in the industry. This Bus Driver & Transceivers category product offers seamless integration and reliable performance, thanks to its superior quality and advanced technology. Ideal for a wide range of applications, this 8-bit transceiver provides a fast propagation delay and low power consumption, ensuring optimal efficiency. Upgrade your projects with the MC74LCX574MEL and experience enhanced functionality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for use in mobile or transportation applications.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures quick and efficient communication, essential for bus driver and transceiver applications where real-time data transmission is crucial.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and enhancing reliability in electronic systems.

No. of Bits: 8

8-bit resolution provides sufficient data processing capability for bus driver and transceiver operations, offering versatility in handling various communication protocols.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources, making it easy to integrate this product into existing electronic systems.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, enhancing the flexibility and control over the bus driver and transceiver functions, improving overall system efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40 °C to 85°C) ensures reliable operation in harsh environmental conditions, making this product suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers MC74LCX574MEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Trade Compliance

MC74LCX574MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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