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MC14099BDWG

Onsemi

MC14099BDWG by Onsemi

MC14099BDWG by Onsemi is a CMOS latch with 16 terminals, operating at -55 to 125 °C. It has a propagation delay of 400 ns at 5V, suitable for military-grade applications. The small outline package is surface-mountable and features low-level trigger type.

Median Price

$0.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 125 parts In-Stock

1+ parts

$0.920

100+ parts

$0.758

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$0.758

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$0.758

125

$0.920

$0.758

$0.758

$0.758

Flip Electronics (Authorized)

USA . 10,904 parts In-Stock

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Digiode

USA . 1,221 parts In-Stock

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$0.874

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Vyrian

USA . 10,073 parts In-Stock

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Flip Electronics

USA . 8,554 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 287 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,093 parts In-Stock

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$0.828

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$0.828

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Corohmni

South Africa . 155 parts In-Stock

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$0.920

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SupplyDigital Components

Austria . 7,821 parts In-Stock

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TANS Electronics

Latvia . 6,335 parts In-Stock

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Problanco Electronics

Mexico . 5,496 parts In-Stock

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Kulean Microsystems

USA . 5,300 parts In-Stock

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Perfect Parts

USA . 2,975 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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UHIMA Technologies

Türkiye . 276 parts In-Stock

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Microchip USA

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Overview

Discover the power of the MC14099BDWG by Onsemi, a top-quality product in the Latches & Flip-Flops category. Manufactured with precision and expertise, this versatile component offers incredible value to customers across various applications. With a nominal supply voltage of 5V and a propagation delay of 400ns, this product stands out for its reliability and efficiency. Experience seamless performance and unmatched benefits with the MC14099BDWG - the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 400 ns

With a low propagation delay, this latch operates efficiently and quickly, making it suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

The latch is designed to operate at a standard 5V supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient energy consumption and reduces power wastage in the circuit.

Power Supplies (V): 5/15

This latch is versatile and can operate within a range of supply voltages, providing flexibility in different system configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this latch can withstand harsh environmental conditions and maintain performance reliability.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this latch to function in extreme cold temperatures, making it suitable for various applications.

Technology: CMOS

The CMOS technology used in this latch ensures low power consumption and high noise immunity, enhancing its overall performance.

Technical Specifications

Latches & Flip-Flops MC14099BDWG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

7.5 mm

Trade Compliance

MC14099BDWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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