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MC14077BFELG

Onsemi

MC14077BFELG by Onsemi

MC14077BFELG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 350ns, and can withstand temperatures from -55 to 125 °C. This small outline package is ideal for military-grade applications requiring fast signal processing.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,016 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

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$0.343

$0.285

$0.254

Verical

USA . 1,016 parts In-Stock

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$0.386

10k+ parts

$0.318

1,016

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$0.386

$0.318

Distributors (In-Stock)

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Digiode

USA . 894 parts In-Stock

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$0.268

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894

$0.268

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Vyrian

USA . 6,115 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 742 parts In-Stock

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$0.240

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742

$0.240

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Corphita

USA . 2,369 parts In-Stock

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$0.254

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2,369

$0.254

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Corohmni

South Africa . 135 parts In-Stock

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$0.282

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135

$0.282

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Component Stockers USA

USA . 702 parts In-Stock

1+ parts

$0.290

100+ parts

$0.270

1k+ parts

$0.250

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-

702

$0.290

$0.270

$0.250

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$14.220

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533

$14.220

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SupplyDigital Components

Austria . 7,812 parts In-Stock

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TANS Electronics

Latvia . 5,800 parts In-Stock

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Kulean Microsystems

USA . 4,603 parts In-Stock

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Problanco Electronics

Mexico . 1,051 parts In-Stock

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Authorized Procurement Solutions

USA . 592 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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Overview

Discover the innovative MC14077BFELG logic gates by Onsemi, renowned for their exceptional quality and reliability. With a focus on cutting-edge technology and precision engineering, Onsemi delivers superior performance in a compact package. These versatile logic gates offer a wide range of applications, providing customers with seamless integration and efficient operation. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your projects to the next level. Choose the MC14077BFELG for unmatched quality and performance that exceeds expectations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 350 ns

Low propagation delay ensures fast response time in processing signals.

No. of Functions: 4

Multiple functions in a single component offer compact and efficient circuit design.

No. of Inputs: 2

Suitable for basic logic operations with 2 input signals.

Nominal Supply Voltage: 5V

Standard voltage level for compatibility with common electronic systems.

Maximum Operating Temperature: 125 °C

Can operate reliably at high temperatures, suitable for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates MC14077BFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14077BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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