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MC14073BCPG

Onsemi

MC14073BCPG by Onsemi

MC14073BCPG by Onsemi is a CMOS Logic Gates IC with 3 functions and inputs. It operates at 5V nominal voltage, with propagation delay of 300ns. Suitable for military applications due to its wide temperature range and through-hole terminal form.

Median Price

$0.263

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Vyrian

USA . 7,407 parts In-Stock

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Digiode

USA . 836 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Holdelec - ElecDif-Pro

France . 260 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 260 parts In-Stock

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Component Sense

UK . 255 parts In-Stock

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Executive Electronics, Inc.

USA . 100 parts In-Stock

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Sensible Micro Corp

USA . 37 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 21 parts In-Stock

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Semtec, LLC

USA . 8 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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AZTECH Wire

Italy . 195 parts In-Stock

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$11.853

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Ampacity Inc.

Singapore . 1,007 parts In-Stock

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TANS Electronics

Latvia . 7,676 parts In-Stock

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Kulean Microsystems

USA . 7,466 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,126 parts In-Stock

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Problanco Electronics

Mexico . 4,748 parts In-Stock

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Corphita

USA . 2,317 parts In-Stock

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SupplyDigital Components

Austria . 1,894 parts In-Stock

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GreenTree Electronics

Israel . 1,770 parts In-Stock

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Kepictronics

USA . 1,075 parts In-Stock

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UHIMA Technologies

Türkiye . 283 parts In-Stock

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Microchip USA

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Aranea Global

USA . 50 parts In-Stock

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Overview

Discover the innovative MC14073BCPG by Onsemi, a high-quality logic gate that offers superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product provides customers with a versatile solution for various applications. With its fast propagation delay and multiple functions, the MC14073BCPG is perfect for demanding projects that require precision and efficiency. Experience the value and benefits of this top-of-the-line product, designed to exceed expectations and deliver exceptional results. Trust Onsemi for cutting-edge technology that elevates your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 300 ns

With a fast propagation delay, this logic gate can quickly process input signals, making it suitable for time-sensitive applications.

No. of Functions: 3

This logic gate offers multiple functions in a single component, saving space and simplifying circuit design.

No. of Inputs: 3

With three inputs, this logic gate can handle multiple input signals simultaneously, increasing its versatility for complex logic operations.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards, optimizing space utilization and layout design.

Technical Specifications

Logic Gates MC14073BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14073BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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