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MC14071BCPG

Onsemi

MC14071BCPG by Onsemi

MC14071BCPG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 300 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a package style of IN-LINE. Ideal for military-grade applications requiring high-speed logic operations.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$0.770

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$0.580

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Vyrian

USA . 3,876 parts In-Stock

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Digiode

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Holdelec - ElecDif-Pro

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ACDS - Activité Composants Distribution Service

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J2 Sourcing AB

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Bristol Electronics

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Atlantic Semiconductor

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ComSIT Distribution GmbH

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Manotoh

Italy . 100 parts In-Stock

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Mil-Aero Solutions, Inc.

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Nova Conductors

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Corohmni

South Africa . 93 parts In-Stock

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AZTECH Wire

Italy . 443 parts In-Stock

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$7.238

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Aztec Data Supply Inc.

USA . 4,454 parts In-Stock

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Advanced Electronics

New Zealand . 800 parts In-Stock

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Ampacity Inc.

Singapore . 1,453 parts In-Stock

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Component Stockers USA

USA . 394 parts In-Stock

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Kepictronics

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Kulean Microsystems

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Microchip USA

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Continental Prestige Electronics

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Problanco Electronics

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SupplyDigital Components

Austria . 1,824 parts In-Stock

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Bastille Electronics

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TANS Electronics

Latvia . 849 parts In-Stock

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Corphita

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Argo Parts USA

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Perfect Parts

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Overview

Experience unparalleled quality and reliability with Onsemi's MC14071BCPG Logic Gates. This innovative product offers a seamless integration of four functions with two inputs, providing unmatched performance in various applications. From military-grade technology to a wide operating temperature range, this product ensures optimal functionality and efficiency. Elevate your projects with the superior value and benefits that the MC14071BCPG brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the logic gates, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 300 ns

The low propagation delay ensures fast signal processing, making these logic gates suitable for applications that require quick response times.

No. of Functions: 4

With the capability to perform four different functions, these logic gates offer versatility and flexibility in designing complex circuits.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, these logic gates are compatible with a wide range of electronic systems.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that these logic gates can withstand extreme temperature variations, making them suitable for rigorous environments.

Technology: CMOS

Utilizing CMOS technology, these logic gates offer low power consumption and high noise immunity, making them efficient and reliable in electronic circuits.

Technical Specifications

Logic Gates MC14071BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14071BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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