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MC14069UBFEL

Onsemi

MC14069UBFEL by Onsemi

MC14069UBFEL by Onsemi is a CMOS Logic Gates IC with 6 functions, 125ns propagation delay at 5V. It has a small outline package style, operates b/w -55 to 125 °C, and supports supply voltages of 3-18V. Ideal for military-grade applications requiring fast signal processing in compact designs.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46,000 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

46,000

-

$0.172

$0.143

$0.127

Verical

USA . 12,000 parts In-Stock

1+ parts

-

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-

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$0.159

12,000

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-

$0.159

Distributors (In-Stock)

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Digiode

USA . 990 parts In-Stock

1+ parts

$0.134

100+ parts

-

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990

$0.134

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Vyrian

USA . 3,668 parts In-Stock

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3,668

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Distributors (Availability)

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Corphita

USA . 1,848 parts In-Stock

1+ parts

$0.127

100+ parts

-

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1,848

$0.127

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Corohmni

South Africa . 206 parts In-Stock

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$0.141

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-

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206

$0.141

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AZTECH Wire

Italy . 84 parts In-Stock

1+ parts

$8.650

100+ parts

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84

$8.650

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Continental Prestige Electronics

USA . 46,000 parts In-Stock

1+ parts

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100+ parts

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$0.122

10k+ parts

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46,000

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-

$0.122

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Kulean Microsystems

USA . 5,426 parts In-Stock

1+ parts

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5,426

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A-Z Elektronik GmbH

Germany . 5,244 parts In-Stock

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5,244

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TANS Electronics

Latvia . 5,088 parts In-Stock

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5,088

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,875 parts In-Stock

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3,875

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SupplyDigital Components

Austria . 3,041 parts In-Stock

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3,041

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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527

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Microchip USA

USA . 315 parts In-Stock

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315

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Overview

Enhance your electronic projects with the MC14069UBFEL by Onsemi, a top-of-the-line logic gate that guarantees reliability and superior performance. As a leading manufacturer in the industry, Onsemi ensures that each component meets the highest quality standards, providing peace of mind for all your applications. From signal processing to data storage, this versatile product offers unmatched value and efficiency, making it an essential tool for any design engineer or hobbyist. Upgrade your circuits today with the MC14069UBFEL and experience the difference in quality and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the product.

Propagation Delay At Nominal Supply: 125 ns

Low propagation delay ensures efficient performance of the logic gates.

Surface Mount: YES

Surface mount capability makes it easy to integrate the product into various electronic circuits.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage range for standard electronic applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space utilization.

Load Capacitance (CL): 50 pF

Optimal load capacitance for smooth signal transmission.

Power Supplies (V): 5/15

Versatile power supply options for different applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range suitable for various environments.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures product reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering onto PCBs.

Technical Specifications

Logic Gates MC14069UBFEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

125 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14069UBFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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