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MC14069UBCPG

Onsemi

MC14069UBCPG by Onsemi

MC14069UBCPG by Onsemi is a CMOS Logic Gates IC with 6 functions, 125ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a package size of 18.86mm x 7.62mm x 4.69mm. Ideal for military-grade applications requiring fast signal processing within a load capacitance of 50pF.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 24 parts In-Stock

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$0.380

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$0.290

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$0.250

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24

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Vyrian

USA . 5,243 parts In-Stock

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Sensible Micro Corp

USA . 845 parts In-Stock

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845

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Rebound Electronics

UK . 800 parts In-Stock

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800

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Digiode

USA . 335 parts In-Stock

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335

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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ComSIT USA

USA . 80 parts In-Stock

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80

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Inventory MP

USA . 28 parts In-Stock

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Bristol Electronics

USA . 28 parts In-Stock

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Semi Source

USA . 24 parts In-Stock

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Executive Electronics, Inc.

USA . 15 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 256 parts In-Stock

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$0.380

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256

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AZTECH Wire

Italy . 768 parts In-Stock

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$20.330

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768

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Ampacity Inc.

Singapore . 1,238 parts In-Stock

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$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,921 parts In-Stock

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Kepictronics

USA . 11,050 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,996 parts In-Stock

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Kulean Microsystems

USA . 6,715 parts In-Stock

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Problanco Electronics

Mexico . 6,026 parts In-Stock

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TANS Electronics

Latvia . 5,828 parts In-Stock

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SupplyDigital Components

Austria . 5,511 parts In-Stock

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Microchip USA

USA . 4,740 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,411 parts In-Stock

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UHIMA Technologies

Türkiye . 803 parts In-Stock

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Perfect Parts

USA . 148 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Elevate your electronic designs with the MC14069UBCPG by Onsemi, a top-tier manufacturer of quality logic gates. This versatile component offers 6 functions in a compact package that ensures reliable performance. Ideal for a wide range of applications, this product provides a seamless integration into your projects with a nominal supply voltage of 5V and a propagation delay of just 125ns. Trust Onsemi to deliver innovation and excellence in every aspect, making your design process smoother and more efficient. Choose the MC14069UBCPG for superior results and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 125 ns

Low propagation delay ensures fast operation of the logic gates, making them suitable for applications where speed is important.

No. of Functions: 6

Having multiple functions in a single package offers space and cost efficiency for circuit design.

Nominal Supply Voltage: 5V

Operating at a common 5V supply voltage makes integration easier with other components in a circuit.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates MC14069UBCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

125 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14069UBCPG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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