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MC14049BCPG

Onsemi

MC14049BCPG by Onsemi

MC14049BCPG by Onsemi is a CMOS Logic Gates IC with 6 functions, 140 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a package style of IN-LINE. Ideal for military-grade applications requiring fast signal processing.

Median Price

$0.248

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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$0.248

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Vyrian

USA . 6,714 parts In-Stock

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Digiode

USA . 516 parts In-Stock

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Bristol Electronics

USA . 35 parts In-Stock

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Atlantic Semiconductor

USA . 35 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 24 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.248

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$0.243

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AZTECH Wire

Italy . 518 parts In-Stock

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$16.231

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Ampacity Inc.

Singapore . 1,505 parts In-Stock

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$56.000

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Kepictronics

USA . 7,875 parts In-Stock

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SupplyDigital Components

Austria . 5,076 parts In-Stock

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Andel Nordic

Denmark . 4,405 parts In-Stock

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Kulean Microsystems

USA . 4,271 parts In-Stock

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TANS Electronics

Latvia . 2,429 parts In-Stock

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Problanco Electronics

Mexico . 2,108 parts In-Stock

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Corphita

USA . 1,367 parts In-Stock

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UHIMA Technologies

Türkiye . 291 parts In-Stock

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Corohmni

South Africa . 144 parts In-Stock

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Microchip USA

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Overview

Discover the MC14049BCPG by Onsemi, a high-quality logic gate that offers unmatched performance and reliability. With 6 functions in one compact package, this product is perfect for a wide range of applications. Onsemi's reputation for excellence ensures that you are getting a top-notch product that will exceed your expectations. Experience fast propagation delay, versatile power supplies, and a durable package body material. Trust in Onsemi to provide you with the value, benefits, and advantages you need to succeed in your projects. Elevate your designs with the MC14049BCPG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 140 ns

The low propagation delay ensures quick processing of signals within the logic gates, leading to efficient performance.

No. of Functions: 6

Having 6 functions within one component offers versatility and flexibility in circuit design, reducing the need for multiple separate components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard logic circuits and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance allows for proper signal transmission and reception without excessive power consumption or signal distortion.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions while maintaining reliable functionality.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for various digital applications.

Technical Specifications

Logic Gates MC14049BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14049BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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