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MC14044BCPG

Onsemi

MC14044BCPG by Onsemi

MC14044BCPG by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It has a true output polarity, operates b/w -55 to 125 °C, and is ideal for military-grade applications requiring low-level trigger type.

Median Price

$0.303

Lifecycle Status

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11

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1k+

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Rochester

USA . 331 parts In-Stock

1+ parts

$0.303

100+ parts

$0.285

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$0.258

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331

$0.303

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Distributors (In-Stock)

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Digiode

USA . 491 parts In-Stock

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$0.288

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Nova Conductors

Japan . 35 parts In-Stock

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$0.290

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Component Electronics Inc.

Canada . 10 parts In-Stock

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$0.770

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$0.580

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$0.500

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$0.770

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Vyrian

USA . 4,966 parts In-Stock

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Bristol Electronics

USA . 360 parts In-Stock

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$0.487

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$0.240

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Microfarads

USA . 340 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Prism Electronics

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Ampacity Inc.

Singapore . 78 parts In-Stock

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$0.258

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78

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Corphita

USA . 2,299 parts In-Stock

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$0.273

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$0.273

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Netroflash

USA . 500 parts In-Stock

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$0.290

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$0.284

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Corohmni

South Africa . 185 parts In-Stock

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AZTECH Wire

Italy . 534 parts In-Stock

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$15.651

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TANS Electronics

Latvia . 7,299 parts In-Stock

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Kulean Microsystems

USA . 5,493 parts In-Stock

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Problanco Electronics

Mexico . 4,532 parts In-Stock

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SupplyDigital Components

Austria . 1,755 parts In-Stock

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Argo Parts USA

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UHIMA Technologies

Türkiye . 973 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

UK . 360 parts In-Stock

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Continental Prestige Electronics

USA . 331 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 200 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Enhance your electronic designs with the MC14044BCPG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product they offer. The MC14044BCPG falls under the category of Latches & Flip-Flops, providing versatile applications for your projects. With a nominal supply voltage of 5V and a propagation delay of 350ns, this product ensures efficient performance. Trust Onsemi to deliver cutting-edge technology that meets your needs, offering value, benefits, and advantages that set you apart from the competition. Elevate your designs with the MC14044BCPG and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable performance and long-lasting durability.

Propagation Delay At Nominal Supply: 350 ns

With a fast propagation delay of 350 ns, this latch offers quick response times for efficient operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into electronic systems.

No. of Bits: 4

With 4 bits, this latch can store multiple pieces of digital information for versatile functionality.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V nominal supply voltage, this latch is compatible with a wide range of electronic devices.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable performance and minimal signal distortion.

Power Supplies (V): 5/15

Supporting a range of power supplies from 5V to 15V, this latch offers flexibility in different electronic setups.

No. of Terminals: 16

With 16 terminals, this latch offers multiple connection points for versatile usage.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and allows for space-efficient mounting in electronic systems.

Propagation Delay (tpd): 350 ns

A propagation delay of 350 ns ensures fast and reliable signal processing.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this latch can withstand high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for multiple output configurations, enhancing versatility.

Trigger Type: LOW LEVEL

Operating on a low-level trigger type, this latch responds efficiently to input signals.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this latch is suitable for a wide range of environments.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options.

Maximum Seated Height: 4.44 mm

The low profile of 4.44 mm ensures space-saving installation in compact electronic devices.

Width: 7.62 mm

With a width of 7.62 mm, this latch is suitable for various electronic applications.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and processing.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V, this latch is energy-efficient.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this latch can undergo reflow soldering processes without damage.

Length: 19.175 mm

The length of 19.175 mm offers a compact size for easy integration into electronic systems.

Temperature Grade: MILITARY

Designed for military-grade applications, this latch meets stringent performance requirements.

Technology: CMOS

The CMOS technology used in this latch offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and provides secure connections.

Packing Method: RAIL

Packaged in a rail configuration, this latch is easy to transport and store.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this latch allows for easy PCB mounting and soldering.

Maximum Supply Voltage (Vsup): 18 V

Operating at a maximum supply voltage of 18V, this latch is suitable for high-power applications.

Technical Specifications

Latches & Flip-Flops MC14044BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

MC14044BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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