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MC10H176MEL

Onsemi

MC10H176MEL by Onsemi

MC10H176MEL by Onsemi is a 6-bit latch with 2.2 ns propagation delay, operating b/w 0-75 °C. It features positive edge trigger, ECL technology, and supports up to 250 MHz frequency. Ideal for high-speed applications in commercial electronics requiring small outline packages and surface mount capabilities.

Median Price

$3.401

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.630

10k+ parts

$2.470

1,242

-

$2.940

$2.630

$2.470

Verical

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.288

10k+ parts

-

1,242

-

$3.862

$3.288

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,599 parts In-Stock

1+ parts

$3.097

100+ parts

-

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1,599

$3.097

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Vyrian

USA . 6,902 parts In-Stock

1+ parts

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6,902

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Distributors (Availability)

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Ampacity Inc.

Singapore . 887 parts In-Stock

1+ parts

$2.650

100+ parts

-

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887

$2.650

-

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Corphita

USA . 1,669 parts In-Stock

1+ parts

$2.934

100+ parts

-

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10k+ parts

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1,669

$2.934

-

-

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

$3.120

100+ parts

-

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315

$3.120

-

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Component Stockers USA

USA . 1,668 parts In-Stock

1+ parts

$3.320

100+ parts

$3.130

1k+ parts

$2.830

10k+ parts

-

1,668

$3.320

$3.130

$2.830

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$10.050

100+ parts

-

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134

$10.050

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SupplyDigital Components

Austria . 8,354 parts In-Stock

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8,354

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Problanco Electronics

Mexico . 6,348 parts In-Stock

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6,348

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 2,972 parts In-Stock

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2,972

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TANS Electronics

Latvia . 1,631 parts In-Stock

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1,631

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Continental Prestige Electronics

USA . 1,242 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.770

10k+ parts

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1,242

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$2.770

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UHIMA Technologies

Türkiye . 826 parts In-Stock

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826

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Microchip USA

USA . 229 parts In-Stock

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229

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Unlock the power of advanced technology with the MC10H176MEL by Onsemi. This high-quality latches & flip-flops component offers unparalleled reliability and performance, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for a wide range of applications, this product provides valuable benefits such as fast propagation delay, true output polarity, and dual terminal positions. Experience the advantage of seamless integration and enhanced functionality with the MC10H176MEL – the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the latch flip-flop suitable for a variety of applications.

Surface Mount: YES

Easy to install and saves space on the PCB.

Propagation Delay (tpd): 2.2 ns

Fast operation ensures efficient performance in time-sensitive applications.

Maximum Operating Temperature: 75 °C

Can operate effectively in a wide range of environmental conditions.

Trigger Type: POSITIVE EDGE

Provides reliable and accurate triggering for data transitions.

Output Polarity: TRUE

Ensures the output signal matches the input signal for accurate data processing.

Maximum Frequency At Nominal Supply: 250000000 Hz

High frequency capability for fast data processing and communication.

Technical Specifications

Latches & Flip-Flops MC10H176MEL attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

123 mA

Propagation Delay (tpd):

2.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H176MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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