Loading...

MC10H135PG

Onsemi

MC10H135PG by Onsemi

MC10H135PG by Onsemi is a 2-bit latch with 16 terminals, operating at -40 to 85 °C. It features a propagation delay of 2.6 ns and max frequency of 250 MHz. Ideal for high-speed applications in commercial electronics due to its ECL technology and positive edge trigger type.

Median Price

$4.556

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,445 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.620

10k+ parts

$3.410

13,445

-

$4.050

$3.620

$3.410

Verical

USA . 3,375 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

3,375

-

$5.063

$4.525

$4.263

Flip Electronics (Authorized)

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,562 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

-

10k+ parts

-

1,562

$4.294

-

-

-

Vyrian

USA . 1,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,932

-

-

-

-

Flip Electronics

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,097 parts In-Stock

1+ parts

$4.068

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$4.068

-

-

-

Corohmni

South Africa . 445 parts In-Stock

1+ parts

$4.520

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$4.520

-

-

-

Component Stockers USA

USA . 63 parts In-Stock

1+ parts

$4.610

100+ parts

$4.340

1k+ parts

$3.920

10k+ parts

$3.920

63

$4.610

$4.340

$3.920

$3.920

AZTECH Wire

Italy . 1,043 parts In-Stock

1+ parts

$14.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,043

$14.370

-

-

-

Kulean Microsystems

USA . 3,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,494

-

-

-

-

TANS Electronics

Latvia . 2,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,694

-

-

-

-

Problanco Electronics

Mexico . 2,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,592

-

-

-

-

Microchip USA

USA . 399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

399

-

-

-

-

UHIMA Technologies

Türkiye . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

SupplyDigital Components

Austria . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155

-

-

-

-

Continental Prestige Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.830

1k+ parts

-

10k+ parts

-

50

-

$3.830

-

-

Perfect Parts

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Overview

Upgrade your electronic designs with the MC10H135PG by Onsemi, a high-quality latch & flip-flop device that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this versatile product is ideal for a wide range of applications. With a fast propagation delay of just 2.6 ns and a maximum operating temperature of 75°C, the MC10H135PG delivers exceptional efficiency and durability. Trust Onsemi for top-notch technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch lightweight and durable, ideal for applications where weight and ruggedness are important factors.

No. of Bits: 2

With 2 bits, this latch can store and process binary information easily, making it suitable for simple logic operations.

Propagation Delay (tpd): 2.6 ns

The low propagation delay of 2.6 ns ensures quick response and data processing, making this latch suitable for high-speed applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures that the latch responds to changes in input signal at the rising edge, providing precise control and timing capabilities.

Maximum Frequency At Nominal Supply: 250000000 Hz

With a maximum frequency of 250 MHz, this latch can handle high-speed data processing, making it suitable for demanding applications.

Technology: ECL

ECL technology offers high-speed and low-power operation, making this latch energy-efficient and suitable for applications where power consumption is a concern.

Minimum fmax: 250 MHz

The minimum fmax of 250 MHz indicates the maximum operating frequency of the latch, ensuring reliable performance in high-speed applications.

Technical Specifications

Latches & Flip-Flops MC10H135PG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H135PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20