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MC10H135FNR2G

Onsemi

MC10H135FNR2G by Onsemi

MC10H135FNR2G by Onsemi is a 20-terminal ECL chip carrier with 2 bits, 2.6ns propagation delay, and max freq of 250MHz. It operates b/w 0-75 °C, suitable for latches & flip-flops in commercial applications requiring positive edge triggering at high speeds.

Median Price

$4.365

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,484 parts In-Stock

1+ parts

-

100+ parts

$3.880

1k+ parts

$3.470

10k+ parts

$3.260

3,484

-

$3.880

$3.470

$3.260

Verical

USA . 1,984 parts In-Stock

1+ parts

-

100+ parts

$4.850

1k+ parts

$4.338

10k+ parts

-

1,984

-

$4.850

$4.338

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,423 parts In-Stock

1+ parts

$4.085

100+ parts

-

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1,423

$4.085

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-

Vyrian

USA . 3,300 parts In-Stock

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3,300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,310 parts In-Stock

1+ parts

$3.650

100+ parts

-

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3,310

$3.650

-

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Corphita

USA . 1,348 parts In-Stock

1+ parts

$3.870

100+ parts

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1,348

$3.870

-

-

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Corohmni

South Africa . 155 parts In-Stock

1+ parts

$4.300

100+ parts

-

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155

$4.300

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AZTECH Wire

Italy . 1,129 parts In-Stock

1+ parts

$15.560

100+ parts

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1,129

$15.560

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Microchip USA

USA . 6,009 parts In-Stock

1+ parts

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6,009

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Problanco Electronics

Mexico . 4,594 parts In-Stock

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4,594

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TANS Electronics

Latvia . 2,653 parts In-Stock

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2,653

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SupplyDigital Components

Austria . 1,982 parts In-Stock

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1,982

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Kulean Microsystems

USA . 1,002 parts In-Stock

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1,002

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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979

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Overview

Unlock a world of possibilities with the MC10H135FNR2G by Onsemi, a high-quality latches & flip-flops chip carrier that offers unmatched performance and reliability. Designed for commercial extended temperature grades, this surface-mount device boasts a maximum frequency of 250MHz, making it perfect for a wide range of applications. With a propagation delay of just 2.6ns, this product provides lightning-fast response times, ensuring seamless operation. Trust Onsemi's legacy of excellence and innovation, and experience the benefits of this cutting-edge technology firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on a circuit board, saving space and simplifying the manufacturing process.

Propagation Delay (tpd): 2.6 ns

With a low propagation delay of 2.6 ns, this latch or flip-flop ensures fast and efficient operation in high-speed applications.

Maximum Frequency At Nominal Supply: 250000000 Hz

The high maximum frequency at nominal supply of 250,000,000 Hz allows for reliable performance in demanding applications that require quick response times.

Output Polarity: COMPLEMENTARY

The complementary output polarity provides versatility in signal processing and allows for a wider range of compatible devices to be connected.

Technical Specifications

Latches & Flip-Flops MC10H135FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

8.965 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H135FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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