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MC10H131MEL

Onsemi

MC10H131MEL by Onsemi

MC10H131MEL by Onsemi is a 2-bit latch with 1.7ns propagation delay, operating at 0-75 °C. It features ECL technology, 250MHz fmax, and is ideal for high-speed applications requiring positive edge triggering in commercial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,409 parts In-Stock

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Digiode

USA . 2,092 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,193 parts In-Stock

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$15.470

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$15.470

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Ampacity Inc.

Singapore . 958 parts In-Stock

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$55.000

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Component Stockers USA

USA . 249 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,633 parts In-Stock

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Kulean Microsystems

USA . 6,351 parts In-Stock

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TANS Electronics

Latvia . 5,044 parts In-Stock

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Microchip USA

USA . 4,051 parts In-Stock

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SupplyDigital Components

Austria . 4,008 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 3,147 parts In-Stock

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Metaverse IC Inc.

Canada . 2,410 parts In-Stock

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Corphita

USA . 1,707 parts In-Stock

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UHIMA Technologies

Türkiye . 568 parts In-Stock

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Corohmni

South Africa . 407 parts In-Stock

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Problanco Electronics

Mexico . 366 parts In-Stock

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Overview

Discover the innovative MC10H131MEL by Onsemi, a high-quality latches & flip-flops device that offers unparalleled performance and reliability. With a small outline package and positive edge trigger type, this product is ideal for a wide range of applications. From telecommunications to industrial automation, this versatile component ensures fast propagation delay and complementary output polarity, making it a valuable asset for your projects. Trust in Onsemi's reputation for excellence and choose the MC10H131MEL for superior results in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and electrical insulation, making the latch or flip-flop resistant to environmental factors and ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation onto circuit boards, saving time and effort during assembly.

Propagation Delay (tpd): 1.7 ns

With a low propagation delay, this latch or flip-flop can quickly respond to input changes, ensuring fast and efficient operation in high-speed circuits.

Maximum Operating Temperature: 75 °C

A high maximum operating temperature allows for reliable performance in a variety of environments, ensuring the latch or flip-flop can withstand elevated temperatures without malfunctioning.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this latch or flip-flop suitable for demanding applications where performance is critical.

Technical Specifications

Latches & Flip-Flops MC10H131MEL attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H131MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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