Loading...

MC10H130FNG

Onsemi

MC10H130FNG by Onsemi

MC10H130FNG by Onsemi is a 2-bit ECL flip-flop with 1.7ns propagation delay, suitable for commercial extended temperature applications. It features open-emitter output and low-level trigger type in a square chip carrier package, making it ideal for high-speed digital systems requiring fast signal processing.

Median Price

$4.118

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,063 parts In-Stock

1+ parts

-

100+ parts

$3.660

1k+ parts

$3.270

10k+ parts

$3.080

3,063

-

$3.660

$3.270

$3.080

Verical

USA . 3,063 parts In-Stock

1+ parts

-

100+ parts

$4.575

1k+ parts

$4.088

10k+ parts

-

3,063

-

$4.575

$4.088

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 588 parts In-Stock

1+ parts

$3.866

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$3.866

-

-

-

Vyrian

USA . 3,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,753

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,340 parts In-Stock

1+ parts

$3.663

100+ parts

-

1k+ parts

-

10k+ parts

-

1,340

$3.663

-

-

-

Corohmni

South Africa . 386 parts In-Stock

1+ parts

$3.940

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$3.940

-

-

-

AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$14.370

100+ parts

-

1k+ parts

-

10k+ parts

-

281

$14.370

-

-

-

TANS Electronics

Latvia . 7,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,458

-

-

-

-

Kulean Microsystems

USA . 7,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,142

-

-

-

-

Problanco Electronics

Mexico . 4,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,733

-

-

-

-

SupplyDigital Components

Austria . 4,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

-

-

-

-

Continental Prestige Electronics

USA . 3,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,063

-

-

-

-

UHIMA Technologies

Türkiye . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Microchip USA

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Overview

Immerse yourself in the world of seamless digital operations with the MC10H130FNG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. The MC10H130FNG falls under the category of Latches & Flip-Flops, offering lightning-fast propagation delay at 1.9ns. With its surface mount capability and chip carrier package style, this product is perfect for applications requiring quick trigger response and high output polarity. Experience the unmatched value and benefits that the MC10H130FNG brings to your projects, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, making the latch or flip-flop suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 1.9 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space utilization on the PCB and making it ideal for applications with limited space.

No. of Bits: 2

The 2 bits configuration allows for binary data storage and processing, making the latch or flip-flop suitable for applications requiring basic logic functionality.

Propagation Delay (tpd): 1.7 ns

The low propagation delay further enhances the speed and efficiency of the latch or flip-flop, ensuring reliable and responsive performance in dynamic applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics provide flexibility for interfacing with various external components, enabling versatile connectivity options.

Trigger Type: LOW LEVEL

The low-level trigger type ensures reliable and stable operation of the latch or flip-flop, making it suitable for applications where precise signal detection is required.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making the latch or flip-flop a reliable and efficient choice for demanding applications.

Technical Specifications

Latches & Flip-Flops MC10H130FNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.9 ns

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

LOW LEVEL

Width:

8.965 mm

Trade Compliance

MC10H130FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20