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MC10EP52DTG

Onsemi

MC10EP52DTG by Onsemi

MC10EP52DTG by Onsemi is a ECL technology latch with 8 terminals, operating at -40 to 85 °C. It has a propagation delay of 0.38 ns and can handle up to 4 GHz frequency. Ideal for industrial applications requiring positive edge triggering in a compact square package.

Median Price

$9.475

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 77 parts In-Stock

1+ parts

$8.060

100+ parts

$7.580

1k+ parts

$6.850

10k+ parts

-

77

$8.060

$7.580

$6.850

-

Mouser Electronics

USA . 214 parts In-Stock

1+ parts

$12.840

100+ parts

$8.660

1k+ parts

$7.880

10k+ parts

-

214

$12.840

$8.660

$7.880

-

DigiKey

USA . 209 parts In-Stock

1+ parts

$12.840

100+ parts

$8.663

1k+ parts

$7.910

10k+ parts

-

209

$12.840

$8.663

$7.910

-

Arrow

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$8.765

1k+ parts

$7.221

10k+ parts

-

200

-

$8.765

$7.221

-

Verical

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$9.475

1k+ parts

$8.563

10k+ parts

-

77

-

$9.475

$8.563

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,357 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

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2,357

$7.657

-

-

-

Vyrian

USA . 6,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,485

-

-

-

-

Sea View Technologies

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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407

-

-

-

-

Bristol Electronics

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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407

-

-

-

-

Prism Electronics

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 938 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

938

$7.254

-

-

-

Corohmni

South Africa . 176 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$8.060

-

-

-

Component Stockers USA

USA . 800 parts In-Stock

1+ parts

$8.300

100+ parts

$8.190

1k+ parts

-

10k+ parts

-

800

$8.300

$8.190

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$18.708

100+ parts

$17.024

1k+ parts

$15.341

10k+ parts

-

3,000

$18.708

$17.024

$15.341

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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26,999

-

-

-

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Kulean Microsystems

USA . 6,613 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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6,613

-

-

-

-

TANS Electronics

Latvia . 6,531 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,531

-

-

-

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Microchip USA

USA . 5,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,947

-

-

-

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SupplyDigital Components

Austria . 1,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,297

-

-

-

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Alle Elektronik GmbH

Germany . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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975

-

-

-

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Problanco Electronics

Mexico . 871 parts In-Stock

1+ parts

-

100+ parts

-

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871

-

-

-

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Perfect Parts

USA . 427 parts In-Stock

1+ parts

-

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427

-

-

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UHIMA Technologies

Türkiye . 90 parts In-Stock

1+ parts

-

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90

-

-

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GreenTree Electronics

Israel . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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49

-

-

-

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Overview

Enhance your electronic designs with the MC10EP52DTG by Onsemi, a top-tier manufacturer known for superior quality and reliability. This small outline, thin profile flip-flop offers lightning-fast 0.38 ns propagation delay, making it ideal for high-speed applications in industrial settings. With a wide temperature range and compact design, this complementary output flip-flop provides exceptional value and performance. Upgrade your projects with the MC10EP52DTG and experience seamless operation and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the latch or flip-flop, ensuring reliable performance over time.

Surface Mount: YES

Easy to install and saves space on the PCB, making it suitable for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Propagate Delay (tpd): 0.38 ns

Provides fast signal propagation, improving overall performance and responsiveness.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed operations and low power consumption.

Maximum Power Supply Current (ICC): 47 mA

Requires low power consumption, making it energy-efficient and cost-effective.

Technical Specifications

Latches & Flip-Flops MC10EP52DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC10EP52DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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