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MC10EP51D

Onsemi

MC10EP51D by Onsemi

MC10EP51D by Onsemi is a ECL technology flip-flop with 0.37 ns propagation delay and 3.3V nominal voltage. It operates in industrial temperature range, suitable for high-speed applications up to 3GHz frequency. This small outline package with gull wing terminals is ideal for surface mount designs.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 13,426 parts In-Stock

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-

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13,426

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Rochester

USA . 2,805 parts In-Stock

1+ parts

-

100+ parts

$2.480

1k+ parts

$2.220

10k+ parts

$2.090

2,805

-

$2.480

$2.220

$2.090

Farnell

UK . 2,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.650

10k+ parts

-

2,805

-

-

$2.650

-

Verical

USA . 2,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.775

10k+ parts

$2.612

2,805

-

-

$2.775

$2.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 423 parts In-Stock

1+ parts

$2.764

100+ parts

-

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423

$2.764

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TEDSS.com

USA . 238 parts In-Stock

1+ parts

$10.000

100+ parts

$8.460

1k+ parts

-

10k+ parts

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238

$10.000

$8.460

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Flip Electronics

USA . 13,426 parts In-Stock

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13,426

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Vyrian

USA . 1,956 parts In-Stock

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1,956

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,242 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

-

10k+ parts

-

2,242

$2.619

-

-

-

Corohmni

South Africa . 215 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

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10k+ parts

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215

$2.650

-

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AZTECH Wire

Italy . 1,038 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

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10k+ parts

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1,038

$12.580

-

-

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$25.624

100+ parts

$23.318

1k+ parts

$21.012

10k+ parts

-

700

$25.624

$23.318

$21.012

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TANS Electronics

Latvia . 7,985 parts In-Stock

1+ parts

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7,985

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Problanco Electronics

Mexico . 5,030 parts In-Stock

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5,030

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RC Electronics

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 4,269 parts In-Stock

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4,269

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Continental Prestige Electronics

USA . 2,805 parts In-Stock

1+ parts

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100+ parts

$2.360

1k+ parts

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10k+ parts

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2,805

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$2.360

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Microchip USA

USA . 292 parts In-Stock

1+ parts

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292

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Kulean Microsystems

USA . 232 parts In-Stock

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232

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UHIMA Technologies

Türkiye . 89 parts In-Stock

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89

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Assy Fe

Spain . 8 parts In-Stock

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8

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Overview

Unlock a world of possibilities with the MC10EP51D by Onsemi, a high-quality latch & flip-flop device that offers unparalleled performance and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this product is designed to meet the needs of industrial applications with its fast propagation delay and wide temperature range. With a compact package style and surface mount capability, the MC10EP51D provides customers with a versatile solution for their design challenges. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and enhances your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 0.42 ns

The low propagation delay ensures fast operation, making it efficient for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easy and convenient, saving space on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard supply voltage, ensuring compatibility with common power sources.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial applications where heat may be a concern.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization in digital circuits.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product ideal for performance-driven applications.

Technical Specifications

Latches & Flip-Flops MC10EP51D attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.42 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

MC10EP51D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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