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MC10EP35DTR2G

Onsemi

MC10EP35DTR2G by Onsemi

MC10EP35DTR2G by Onsemi is a 2-bit ECL flip-flop with 0.49 ns propagation delay, suitable for industrial applications. It operates at -40 to 85 °C and supports a max frequency of 3 GHz. With a small outline package and dual terminals, it offers fast performance in high-speed digital circuits.

Median Price

$8.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$7.230

1k+ parts

$6.470

10k+ parts

$6.090

15,000

-

$7.230

$6.470

$6.090

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$9.037

1k+ parts

$8.088

10k+ parts

$7.612

12,500

-

$9.037

$8.088

$7.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 621 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

-

621

$7.657

-

-

-

Vyrian

USA . 12,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 868 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$7.254

-

-

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$8.060

-

-

-

Component Stockers USA

USA . 9,185 parts In-Stock

1+ parts

$8.140

100+ parts

$7.660

1k+ parts

$6.920

10k+ parts

$6.920

9,185

$8.140

$7.660

$6.920

$6.920

AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$17.670

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$17.670

-

-

-

Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.840

10k+ parts

-

15,000

-

-

$6.840

-

Problanco Electronics

Mexico . 8,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,321

-

-

-

-

Microchip USA

USA . 4,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,275

-

-

-

-

SupplyDigital Components

Austria . 4,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,178

-

-

-

-

Kulean Microsystems

USA . 2,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

-

-

-

-

TANS Electronics

Latvia . 1,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

-

-

-

-

UHIMA Technologies

Türkiye . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

810

-

-

-

-

Overview

Upgrade your electronics with the MC10EP35DTR2G by Onsemi. Known for their high quality and reliability, Onsemi delivers top-notch latches & flip-flops that are perfect for a wide range of applications. With fast propagation delay, low power consumption, and compact design, this product offers unbeatable value to customers looking for efficient and high-performance components. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the latch/flip-flop.

Propagation Delay At Nominal Supply: 0.575 ns

Low propagation delay ensures fast operation and efficient performance of the latch/flip-flop.

Surface Mount: YES

Surface mount capability makes installation and integration of the latch/flip-flop easier and more convenient.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable voltage supply for stable and reliable operation of the latch/flip-flop.

Maximum Frequency At Nominal Supply: 3000000000 Hz

High maximum frequency allows for fast switching and processing speeds in the latch/flip-flop.

Technology: ECL

ECL technology ensures high speed and low power consumption in the operation of the latch/flip-flop.

Technical Specifications

Latches & Flip-Flops MC10EP35DTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.49 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC10EP35DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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