Loading...

MC10EP35DT

Onsemi

MC10EP35DT by Onsemi

MC10EP35DT by Onsemi is a 2-bit ECL flip-flop with 0.49 ns propagation delay, suitable for industrial applications. It operates at -40 to 85 °C, with Vsup ranging from 3V to 5.5V and max frequency of 3GHz. The small outline package has dual terminals and Gull Wing form, making it ideal for high-speed digital circuits.

Median Price

$4.525

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,995 parts In-Stock

1+ parts

-

100+ parts

$3.620

1k+ parts

$3.240

10k+ parts

$3.050

3,995

-

$3.620

$3.240

$3.050

DigiKey

USA . 3,995 parts In-Stock

1+ parts

-

100+ parts

$4.760

1k+ parts

-

10k+ parts

-

3,995

-

$4.760

-

-

Verical

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$4.525

1k+ parts

$4.050

10k+ parts

$3.813

2,400

-

$4.525

$4.050

$3.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,000 parts In-Stock

1+ parts

$3.828

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$3.828

-

-

-

Vyrian

USA . 6,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,663

-

-

-

-

R&J Components

USA . 58 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,832 parts In-Stock

1+ parts

$3.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,832

$3.430

-

-

-

Corphita

USA . 2,265 parts In-Stock

1+ parts

$3.627

100+ parts

-

1k+ parts

-

10k+ parts

-

2,265

$3.627

-

-

-

Corohmni

South Africa . 105 parts In-Stock

1+ parts

$4.030

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$4.030

-

-

-

AZTECH Wire

Italy . 170 parts In-Stock

1+ parts

$19.050

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$19.050

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,295

-

-

-

-

Kulean Microsystems

USA . 7,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,324

-

-

-

-

Problanco Electronics

Mexico . 6,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,637

-

-

-

-

SupplyDigital Components

Austria . 6,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,413

-

-

-

-

Microchip USA

USA . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

-

-

-

-

Continental Prestige Electronics

USA . 3,995 parts In-Stock

1+ parts

-

100+ parts

$3.420

1k+ parts

-

10k+ parts

-

3,995

-

$3.420

-

-

TANS Electronics

Latvia . 1,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,408

-

-

-

-

UHIMA Technologies

Türkiye . 509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

509

-

-

-

-

Overview

Enhance your electronic designs with the high-quality MC10EP35DT by Onsemi. This versatile latch and flip-flop component offers superior performance and reliability, making it ideal for a wide range of applications. With its innovative technology and industrial-grade construction, this product provides customers with unmatched value and efficiency. Trust Onsemi to deliver cutting-edge solutions that elevate your projects to new heights. Choose the MC10EP35DT and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 0.575 ns

Offers fast operation and response times for efficient processing of signals.

Surface Mount: YES

Enables easy and convenient installation onto circuit boards for streamlined assembly.

Package Shape: SQUARE

Helps in saving space and creating a neat layout on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

Matches common supply voltages, making it compatible with various systems.

Power Supplies (V): -5.2

Supports negative power supplies, expanding the versatility of the latch or flip-flop.

Propagation Delay (tpd): 0.49 ns

Ensures rapid signal processing and efficient performance.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures without issues, making it suitable for industrial environments.

Trigger Type: POSITIVE EDGE

Provides precise triggering and control for accurate signal processing.

Minimum Supply Voltage (Vsup): 3 V

Allows the latch or flip-flop to operate efficiently at lower supply voltages.

Technical Specifications

Latches & Flip-Flops MC10EP35DT attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.49 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC10EP35DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20