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MC10EP31MNR4G

Onsemi

MC10EP31MNR4G by Onsemi

MC10EP31MNR4G by Onsemi is a Square-shaped Latch & Flip-Flop with 8 terminals. It operates at -40 to 85 °C, with a Vsup range of 3-5.5V and tpd of 0.41ns. Ideal for high-speed applications up to 3GHz, it features ECL technology and positive edge triggering.

Median Price

$5.036

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,999 parts In-Stock

1+ parts

-

100+ parts

$4.360

1k+ parts

$3.900

10k+ parts

$3.670

13,999

-

$4.360

$3.900

$3.670

Verical

USA . 13,999 parts In-Stock

1+ parts

-

100+ parts

$5.713

1k+ parts

$5.162

10k+ parts

-

13,999

-

$5.713

$5.162

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 892 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

892

$4.617

-

-

-

Vyrian

USA . 11,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,327

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,927 parts In-Stock

1+ parts

$4.374

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$4.374

-

-

-

Corohmni

South Africa . 447 parts In-Stock

1+ parts

$4.640

100+ parts

-

1k+ parts

-

10k+ parts

-

447

$4.640

-

-

-

AZTECH Wire

Italy . 913 parts In-Stock

1+ parts

$10.510

100+ parts

-

1k+ parts

-

10k+ parts

-

913

$10.510

-

-

-

Continental Prestige Electronics

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.130

10k+ parts

-

14,000

-

-

$4.130

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,156 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,156

-

-

-

-

TANS Electronics

Latvia . 3,033 parts In-Stock

1+ parts

-

100+ parts

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3,033

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-

-

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SupplyDigital Components

Austria . 1,741 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,741

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-

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Problanco Electronics

Mexico . 402 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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402

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Microchip USA

USA . 394 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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394

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Kulean Microsystems

USA . 290 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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290

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UHIMA Technologies

Türkiye . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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146

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Overview

Unleash the power of innovation with the MC10EP31MNR4G by Onsemi. As a leader in the industry, Onsemi delivers top-notch quality in every product, including this latches & flip-flops gem. Ideal for a wide range of applications, this surface mount device offers unparalleled value to customers seeking reliability and efficiency without compromise. Take your projects to the next level with the MC10EP31MNR4G and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving time and space in electronic assemblies.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic components and systems.

Propagation Delay (tpd): 0.41 ns

The low propagation delay of 0.41ns ensures fast and efficient operation of the latch or flip-flop.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and accurate signal processing in digital circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C makes this product suitable for industrial applications where temperature variations are common.

Maximum Frequency At Nominal Supply: 3000000000 Hz

The high maximum frequency at nominal supply voltage allows for high-speed operations in digital systems.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed performance and low power consumption, making it ideal for demanding applications.

Technical Specifications

Latches & Flip-Flops MC10EP31MNR4G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V

Family:

10E

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.41 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Trade Compliance

MC10EP31MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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