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MC10EL31DTG

Onsemi

MC10EL31DTG by Onsemi

MC10EL31DTG by Onsemi is a ECL technology latch with 8 terminals, operating at -40 to 85 °C. It has a propagation delay of 0.59 ns and can handle up to 2.2 GHz frequency. Ideal for industrial applications requiring fast positive edge triggers in compact designs.

Median Price

$3.138

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 585 parts In-Stock

1+ parts

-

100+ parts

$3.240

1k+ parts

-

10k+ parts

-

585

-

$3.240

-

-

Rochester

USA . 324 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

324

-

$2.800

$2.510

$2.360

Verical

USA . 324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

324

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,535 parts In-Stock

1+ parts

$2.964

100+ parts

-

1k+ parts

-

10k+ parts

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1,535

$2.964

-

-

-

Vyrian

USA . 7,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,533

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,013 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

-

2,013

$2.808

-

-

-

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$2.980

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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22,796

-

-

-

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Kulean Microsystems

USA . 8,189 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,189

-

-

-

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TANS Electronics

Latvia . 7,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,468

-

-

-

-

Problanco Electronics

Mexico . 5,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,331

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-

-

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SupplyDigital Components

Austria . 3,608 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,608

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-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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Continental Prestige Electronics

USA . 719 parts In-Stock

1+ parts

-

100+ parts

$2.650

1k+ parts

-

10k+ parts

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719

-

$2.650

-

-

Microchip USA

USA . 342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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342

-

-

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UHIMA Technologies

Türkiye . 195 parts In-Stock

1+ parts

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100+ parts

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195

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Perfect Parts

USA . 141 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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141

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Overview

Elevate your electronic designs with the MC10EL31DTG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their latches & flip-flops category. This versatile product offers customers exceptional value and benefits, providing fast propagation delays, precise trigger types, and a wide temperature range for industrial applications. Trust Onsemi to exceed your expectations and bring innovation to your projects with the MC10EL31DTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and lightweight, ideal for various electronic applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power sources in electronic systems.

Propagation Delay (tpd): 0.59 ns

With a low propagation delay, this latch can switch states quickly and efficiently, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

The latch can operate reliably in a wide range of temperatures, making it suitable for industrial environments.

Maximum Frequency At Nominal Supply: 2000000000 Hz

The high maximum frequency capability allows for fast operation, making this latch ideal for high-performance systems.

Technical Specifications

Latches & Flip-Flops MC10EL31DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay (tpd):

.59 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

2200 MHz

Trade Compliance

MC10EL31DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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