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MC10E196FNR2

Onsemi

MC10E196FNR2 by Onsemi

MC10E196FNR2 by Onsemi is a delay line with 4.72ns propagation delay at 5V, ECL technology, and 127 taps/steps. It is used in applications requiring precise timing control such as high-speed communication systems and data transmission equipment.

Median Price

$3.858

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

500

-

$3.430

$3.070

$2.890

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$4.063

10k+ parts

-

500

-

$4.287

$4.063

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 733 parts In-Stock

1+ parts

$2.910

100+ parts

-

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733

$2.910

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Digiode

USA . 1,874 parts In-Stock

1+ parts

$3.629

100+ parts

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1,874

$3.629

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 332 parts In-Stock

1+ parts

$2.910

100+ parts

-

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332

$2.910

-

-

-

Corphita

USA . 2,206 parts In-Stock

1+ parts

$3.438

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-

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2,206

$3.438

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Kulean Microsystems

USA . 7,745 parts In-Stock

1+ parts

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7,745

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SupplyDigital Components

Austria . 7,390 parts In-Stock

1+ parts

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7,390

-

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Problanco Electronics

Mexico . 7,129 parts In-Stock

1+ parts

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7,129

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Microchip USA

USA . 6,929 parts In-Stock

1+ parts

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6,929

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TANS Electronics

Latvia . 2,084 parts In-Stock

1+ parts

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2,084

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Kepictronics

USA . 1,400 parts In-Stock

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1,400

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Continental Prestige Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.590

1k+ parts

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500

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$4.590

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UHIMA Technologies

Türkiye . 229 parts In-Stock

1+ parts

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229

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Experience the ultimate precision and reliability with the MC10E196FNR2 delay line by Onsemi. As a leader in semiconductor technology, Onsemi ensures top-notch quality and performance. This versatile chip carrier offers a wide range of applications, providing customers with unparalleled value and benefits. With its programmable delay line feature, this product is perfect for advanced timing applications where accuracy is crucial. Trust Onsemi to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the delay line, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 4.72 ns

Low propagation delay ensures efficient signal transmission, making this delay line suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the circuit board, enhancing overall design flexibility.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes integration into existing systems seamless and reduces the need for additional components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this delay line can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Programmable Delay Line: YES

Being programmable allows for customizable delay settings, making this delay line versatile and suitable for a wide range of applications.

Technical Specifications

Delay Lines MC10E196FNR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-4.2 V TO -5.7 V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC10E196FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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