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MC10E167FNG

Onsemi

MC10E167FNG by Onsemi

MC10E167FNG by Onsemi is a 6-bit ECL flip-flop with 0.8 ns propagation delay, operating at 1 GHz. It has 2 inputs, operates on a 5V supply, and can handle temperatures from 0 to 85 °C. Ideal for high-speed applications requiring fast signal processing in electronic systems.

Median Price

$5.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,015 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

-

10k+ parts

-

2,015

-

$5.350

-

-

Rochester

USA . 1,968 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

1,968

-

$5.550

$4.960

$4.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,990 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

10k+ parts

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1,990

$5.871

-

-

-

Vyrian

USA . 8,362 parts In-Stock

1+ parts

-

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8,362

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,795 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

$4.550

-

-

-

Corohmni

South Africa . 443 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

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10k+ parts

-

443

$5.350

-

-

-

Corphita

USA . 1,279 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

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10k+ parts

-

1,279

$5.562

-

-

-

Component Stockers USA

USA . 1,332 parts In-Stock

1+ parts

$6.290

100+ parts

$5.920

1k+ parts

$5.350

10k+ parts

-

1,332

$6.290

$5.920

$5.350

-

AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$18.370

100+ parts

-

1k+ parts

-

10k+ parts

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601

$18.370

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 15,792 parts In-Stock

1+ parts

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100+ parts

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15,792

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-

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Kulean Microsystems

USA . 6,691 parts In-Stock

1+ parts

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100+ parts

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6,691

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TANS Electronics

Latvia . 5,076 parts In-Stock

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5,076

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SupplyDigital Components

Austria . 4,792 parts In-Stock

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4,792

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Microchip USA

USA . 4,777 parts In-Stock

1+ parts

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4,777

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Problanco Electronics

Mexico . 2,385 parts In-Stock

1+ parts

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2,385

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Continental Prestige Electronics

USA . 2,015 parts In-Stock

1+ parts

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2,015

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UHIMA Technologies

Türkiye . 825 parts In-Stock

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825

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Overview

Upgrade your electronic projects with the MC10E167FNG by Onsemi, a top-of-the-line latches & flip-flops component that guarantees precision and reliability. Crafted with quality materials and cutting-edge technology, this chip carrier package offers lightning-fast propagation delay at 1.05 ns and a high maximum operating temperature of 85 °C. Perfect for applications requiring fast response times, this product is a game-changer in the industry, providing customers with unparalleled performance and value. Experience the difference with Onsemi's MC10E167FNG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 0.8 ns

The low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Inputs: 2

Having 2 inputs allows for versatile input options and functionality in various circuit designs.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on a circuit board.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage provides compatibility with standard power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a range of environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for flexibility in connecting to other components in a circuit.

Trigger Type: POSITIVE EDGE

The positive edge trigger type enables precise timing control in latch or flip-flop operations.

Width: 11.505 mm

The compact width allows for efficient use of space on a circuit board.

Technical Specifications

Latches & Flip-Flops MC10E167FNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

No. of Bits:

6

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

113 mA

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

1.05 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC10E167FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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