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MC10E131FNR2G

Onsemi

MC10E131FNR2G by Onsemi

D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$13.010

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.840

10k+ parts

-

932

-

-

$11.840

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$13.010

1k+ parts

$11.640

10k+ parts

$10.950

500

-

$13.010

$11.640

$10.950

Verical

USA . 432 parts In-Stock

1+ parts

-

100+ parts

$16.262

1k+ parts

$14.550

10k+ parts

$13.688

432

-

$16.262

$14.550

$13.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,203 parts In-Stock

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6,203

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Digiode

USA . 2,409 parts In-Stock

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2,409

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Distributors (Availability)

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

$11.840

100+ parts

-

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293

$11.840

-

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AZTECH Wire

Italy . 908 parts In-Stock

1+ parts

$12.620

100+ parts

-

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908

$12.620

-

-

-

Component Stockers USA

USA . 78 parts In-Stock

1+ parts

$14.780

100+ parts

-

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78

$14.780

-

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Microchip USA

USA . 3,199 parts In-Stock

1+ parts

$42.748

100+ parts

-

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3,199

$42.748

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TANS Electronics

Latvia . 7,207 parts In-Stock

1+ parts

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7,207

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Problanco Electronics

Mexico . 3,291 parts In-Stock

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3,291

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Perfect Parts

USA . 958 parts In-Stock

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958

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Kulean Microsystems

USA . 505 parts In-Stock

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505

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Corphita

USA . 364 parts In-Stock

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364

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SupplyDigital Components

Austria . 73 parts In-Stock

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73

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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27

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Technical Specifications

Latches & Flip-Flops MC10E131FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

.675 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC10E131FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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