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MC100LVEL51DR2G

Onsemi

MC100LVEL51DR2G by Onsemi

MC100LVEL51DR2G by Onsemi is a high-speed ECL flip-flop with 0.52 ns propagation delay at 3.3V, ideal for industrial applications. It features positive edge trigger, complementary output polarity, and operates up to 2.9 GHz frequency. With small outline package style and surface mount capability, it offers efficient performance in compact designs.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,911 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

4,911

-

$3.130

$2.800

$2.630

Verical

USA . 2,190 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

2,190

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,650 parts In-Stock

1+ parts

$3.306

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-

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1,650

$3.306

-

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Chip Stock

USA . 3,970 parts In-Stock

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3,970

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ACDS - Activité Composants Distribution Service

France . 2,951 parts In-Stock

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2,951

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Vyrian

USA . 2,340 parts In-Stock

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2,340

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Semi Source

USA . 217 parts In-Stock

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217

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Distributors (Availability)

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Benley Electronics

USA . 112 parts In-Stock

1+ parts

$0.300

100+ parts

-

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112

$0.300

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Corphita

USA . 2,275 parts In-Stock

1+ parts

$3.132

100+ parts

-

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2,275

$3.132

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Corohmni

South Africa . 392 parts In-Stock

1+ parts

$3.480

100+ parts

-

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392

$3.480

-

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Component Stockers USA

USA . 4,321 parts In-Stock

1+ parts

$3.600

100+ parts

$3.380

1k+ parts

$3.060

10k+ parts

-

4,321

$3.600

$3.380

$3.060

-

AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$14.410

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710

$14.410

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Problanco Electronics

Mexico . 6,257 parts In-Stock

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6,257

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Kulean Microsystems

USA . 5,329 parts In-Stock

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5,329

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TANS Electronics

Latvia . 5,034 parts In-Stock

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5,034

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SupplyDigital Components

Austria . 3,312 parts In-Stock

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3,312

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 484 parts In-Stock

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484

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Microchip USA

USA . 291 parts In-Stock

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291

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Overview

Enhance your electronic projects with the MC100LVEL51DR2G by Onsemi, a high-quality latches and flip-flops component that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is ideal for a wide range of applications. With fast propagation delay and open-emitter output characteristics, this versatile component provides value and benefits to customers looking for precision and efficiency. Upgrade your designs with the MC100LVEL51DR2G and experience the advantages of using top-notch technology in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.55 ns

The fast propagation delay ensures quick response times, making this latch ideal for applications requiring rapid switching.

Surface Mount: YES

Surface mount capability makes installation and integration into circuit boards easier and more efficient.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a common supply voltage, making it easy to integrate into existing systems.

Technology: ECL

ECL technology offers high speed and low power consumption, making it suitable for high-performance applications.

Technical Specifications

Latches & Flip-Flops MC100LVEL51DR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2900000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

37 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.52 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

2800 MHz

Trade Compliance

MC100LVEL51DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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