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MC100LVEL30DWG

Onsemi

MC100LVEL30DWG by Onsemi

MC100LVEL30DWG by Onsemi is a 3-bit latch with 0.82 ns propagation delay, operating at -40 to 85 °C. It features ECL technology, 1200 MHz fmax, and is ideal for industrial applications requiring fast positive edge triggering in a small outline package.

Median Price

$6.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 470 parts In-Stock

1+ parts

$6.810

100+ parts

$6.670

1k+ parts

$6.540

10k+ parts

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470

$6.810

$6.670

$6.540

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Distributors (In-Stock)

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Digiode

USA . 1,685 parts In-Stock

1+ parts

$6.470

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1,685

$6.470

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Vyrian

USA . 5,632 parts In-Stock

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5,632

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Bristol Electronics

USA . 54 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 754 parts In-Stock

1+ parts

$6.129

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754

$6.129

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Corohmni

South Africa . 193 parts In-Stock

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$6.810

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193

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AZTECH Wire

Italy . 1,146 parts In-Stock

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$12.210

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TANS Electronics

Latvia . 7,882 parts In-Stock

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Kulean Microsystems

USA . 6,591 parts In-Stock

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SupplyDigital Components

Austria . 3,123 parts In-Stock

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Problanco Electronics

Mexico . 1,699 parts In-Stock

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1,699

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Microchip USA

USA . 481 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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ChipTracer

USA . 54 parts In-Stock

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Perfect Parts

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Overview

Elevate your electronics with the MC100LVEL30DWG from Onsemi, a leading manufacturer known for top-quality components. This latch & flip-flop device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With a compact design and advanced technology, this product provides customers with unmatched value, ensuring seamless operation and optimal functionality. Upgrade your projects with the MC100LVEL30DWG and experience the difference that superior quality and precision engineering can bring to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

No. of Bits: 3

Allows for efficient storage and processing of data in the latch.

Nominal Supply Voltage / Vsup (V): 3.3

Stable and standard supply voltage for reliable operation of the latch.

Propagation Delay (tpd): 0.82 ns

Fast response time ensures quick and accurate switching of the latch.

Trigger Type: POSITIVE EDGE

Enables precise triggering of the latch based on positive edge transitions.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Minimum fmax: 1200 MHz

High maximum frequency allows for rapid data processing and operation of the latch.

Technical Specifications

Latches & Flip-Flops MC100LVEL30DWG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay (tpd):

.82 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

1200 MHz

Trade Compliance

MC100LVEL30DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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