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MC100EP29DTR2

Onsemi

MC100EP29DTR2 by Onsemi

MC100EP29DTR2 by Onsemi is a dual-function ECL latch with 0.5ns propagation delay, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5V and is ideal for industrial applications requiring positive edge triggering in a compact 20-terminal package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,837 parts In-Stock

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Digiode

USA . 2,447 parts In-Stock

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AZTECH Wire

Italy . 1,136 parts In-Stock

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$20.220

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,384 parts In-Stock

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Problanco Electronics

Mexico . 3,207 parts In-Stock

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Kepictronics

USA . 2,458 parts In-Stock

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SupplyDigital Components

Austria . 1,334 parts In-Stock

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Kulean Microsystems

USA . 1,190 parts In-Stock

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Corphita

USA . 479 parts In-Stock

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Corohmni

South Africa . 454 parts In-Stock

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Microchip USA

USA . 327 parts In-Stock

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UHIMA Technologies

Türkiye . 108 parts In-Stock

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Overview

Unleash the power of precision with the MC100EP29DTR2 by Onsemi. As a leader in latches & flip-flops, Onsemi delivers unparalleled quality and reliability in every product. Ideal for industrial applications, this small outline, thin profile package offers lightning-fast 0.5 ns propagation delay and a temperature range from -40 to 85 °C. With dual terminal positions and complementary output polarity, this innovative technology guarantees seamless operation. Elevate your projects with Onsemi's MC100EP29DTR2 and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this latch/flip-flop suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the circuit board, making it a convenient choice for compact electronic devices.

No. of Functions: 2

Having two functions allows for more versatility in the circuit design, providing flexibility in the operation of the latch/flip-flop.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems, making it a versatile option for various applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and precise operation, making this latch/flip-flop suitable for applications where timing accuracy is crucial.

Technical Specifications

Latches & Flip-Flops MC100EP29DTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC100EP29DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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