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MC100ELT23D

Onsemi

MC100ELT23D by Onsemi

MC100ELT23D by Onsemi is a voltage level translator with 2 functions, operating b/w -40 to 85 °C. It has a supply voltage range of 4.75-5.25 V and max delay of 5.5 ns. Ideal for PECL to TTL translation in industrial applications due to its ECL technology and small outline package style.

Median Price

$2.095

Lifecycle Status

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27

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1k+

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TEDSS.com

USA . 298 parts In-Stock

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Freelance Electronics

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PC Components Company LLC

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ComSIT Distribution GmbH

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Legend Electronics Inc.

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NAC Semi

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corohmni

South Africa . 72 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Overview

Discover the unparalleled performance and reliability of the MC100ELT23D by Onsemi, a top-tier manufacturer known for its cutting-edge technology. This voltage level translator is perfect for a wide range of applications, offering seamless communication between PECL and TTL systems. With a robust construction and advanced features, this product ensures smooth operation and optimal efficiency. Upgrade your system today with the MC100ELT23D and experience improved functionality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to corrosion, making this product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product on a printed circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can easily handle a wide range of input voltages, providing flexibility in various applications.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying the circuit design and saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to place and secure on the PCB, ensuring a stable and space-efficient mounting.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V makes this voltage level translator compatible with a wide range of systems and devices.

No. of Terminals: 8

Having multiple terminals allows for versatile connectivity options, enabling the product to interface with different components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this product suitable for compact designs and applications with limited board real estate.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, this voltage level translator can operate in systems with lower power requirements, offering compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand heat and operate reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, ensuring consistent performance in various temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable and durable connection, improving the overall reliability and lifespan of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and enables easy integration into different PCB layouts, enhancing compatibility with various systems.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact and slim profile, making this product suitable for space-constrained applications and designs.

Width: 3.9 mm

The narrow width of the product enables it to be placed in tight spaces on the PCB, contributing to a more efficient use of board real estate and layout flexibility.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal conversion and compatibility with different logic levels, enhancing the overall performance and reliability of the product.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for reliable and efficient soldering during the assembly process, ensuring a secure and durable connection on the PCB.

Length: 4.9 mm

The compact length of the product contributes to a space-efficient design, making it ideal for applications where size and layout constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product can withstand harsh environmental conditions and operate reliably in demanding industrial settings.

Technology: ECL

Employing ECL technology provides high-speed and low-power operation, making this voltage level translator suitable for applications that require fast signal processing and minimal power consumption.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable soldering connections, ensuring a stable and durable attachment to the PCB for long-term performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and allows for seamless integration into existing systems and designs.

Maximum Delay: 5.5 ns

With a low maximum delay, this voltage level translator can quickly and efficiently translate signals between different voltage levels, enabling high-speed signal processing in the circuit.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm allows for easy and accurate placement of the product on the PCB, facilitating smooth integration and assembly during production.

Interface IC Type: PECL TO TTL TRANSLATOR

Featuring a PECL to TTL interface IC type, this product enables seamless signal translation between different logic levels, enhancing the compatibility and versatility of the circuit design.

Technical Specifications

Voltage Level Translators MC100ELT23D attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100ELT23D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-631-9566, 5962016319566

NIIN

016319566

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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