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MC100EL51DT

Onsemi

MC100EL51DT by Onsemi

MC100EL51DT by Onsemi is a ECL technology flip-flop with 0.565 ns propagation delay, 1800000000 Hz max frequency, and 5V nominal supply. Ideal for industrial applications requiring fast trigger response and complementary output polarity in a compact thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,608 parts In-Stock

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Digiode

USA . 1,913 parts In-Stock

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Prism Electronics

USA . 315 parts In-Stock

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AZTECH Wire

Italy . 191 parts In-Stock

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$13.090

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Component Stockers USA

USA . 516 parts In-Stock

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$99.990

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516

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Problanco Electronics

Mexico . 5,319 parts In-Stock

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TANS Electronics

Latvia . 4,793 parts In-Stock

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Kulean Microsystems

USA . 4,725 parts In-Stock

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Corphita

USA . 2,484 parts In-Stock

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SupplyDigital Components

Austria . 951 parts In-Stock

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951

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UHIMA Technologies

Türkiye . 820 parts In-Stock

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Microchip USA

USA . 456 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 307 parts In-Stock

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Overview

Unleash the power of seamless digital operations with the MC100EL51DT by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their latches & flip-flops. With lightning-fast propagation delay and a wide range of applications, this product is a game-changer for your electronic projects. Experience the value of precision engineering and innovative design with the MC100EL51DT, offering unmatched benefits and advantages that will elevate your performance to new heights. Elevate your projects with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 0.62 ns

The low propagation delay ensures fast response times, making the latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this latch or flip-flop is easy to install on printed circuit boards, saving space and allowing for efficient assembly.

Propagation Delay: 0.565 ns

With a quick propagation delay, the latch or flip-flop can process signals rapidly, enhancing overall performance.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the latch or flip-flop to function reliably in various environments, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with many integrated circuits and power supplies, ensuring easy integration into existing systems.

Trigger Type: POSITIVE EDGE

The positive edge trigger type provides precise control and synchronization of data, making the latch or flip-flop ideal for applications requiring accurate timing.

Technology: ECL

The ECL technology used in this product offers high-speed operation and low power consumption, making it suitable for demanding applications requiring fast switching.

Technical Specifications

Latches & Flip-Flops MC100EL51DT attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1800000000 Hz

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

.62 ns

Propagation Delay (tpd):

.565 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

2200 MHz

Trade Compliance

MC100EL51DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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