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MC100E143FNR2G

Onsemi

MC100E143FNR2G by Onsemi

MC100E143FNR2G by Onsemi is a 9-bit ECL flip-flop with 1ns propagation delay. Operating b/w 0-85°C, it has a supply voltage range of 4.2-5.7V and peak reflow temp of 260°C. Ideal for applications requiring fast trigger response and high-frequency operation in compact designs.

Median Price

$6.938

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

1,234

-

$5.550

$4.960

$4.670

DigiKey

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

$7.300

1k+ parts

-

10k+ parts

-

1,234

-

$7.300

-

-

Verical

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

1,234

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.852

100+ parts

-

1k+ parts

-

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100

$5.852

-

-

-

Digiode

USA . 478 parts In-Stock

1+ parts

$5.871

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-

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478

$5.871

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-

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Vyrian

USA . 12,684 parts In-Stock

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12,684

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,009 parts In-Stock

1+ parts

$4.940

100+ parts

-

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-

10k+ parts

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1,009

$4.940

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Corphita

USA . 1,119 parts In-Stock

1+ parts

$5.562

100+ parts

-

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1,119

$5.562

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Corohmni

South Africa . 202 parts In-Stock

1+ parts

$5.810

100+ parts

-

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202

$5.810

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$5.852

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-

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500

$5.852

-

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$17.990

100+ parts

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847

$17.990

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Problanco Electronics

Mexico . 7,363 parts In-Stock

1+ parts

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7,363

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Kulean Microsystems

USA . 7,184 parts In-Stock

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Microchip USA

USA . 4,550 parts In-Stock

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4,550

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SupplyDigital Components

Austria . 2,173 parts In-Stock

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2,173

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Continental Prestige Electronics

USA . 1,234 parts In-Stock

1+ parts

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100+ parts

$5.210

1k+ parts

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1,234

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$5.210

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TANS Electronics

Latvia . 1,107 parts In-Stock

1+ parts

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1,107

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UHIMA Technologies

Türkiye . 608 parts In-Stock

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608

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Overview

Unleash the power of precision and reliability with the MC100E143FNR2G by Onsemi. Crafted with quality materials and cutting-edge technology, this latches & flip-flops component offers seamless performance in a compact square package. Perfect for applications requiring fast response times and accurate data processing, this product delivers unmatched value and efficiency to customers. Experience the advantages of superior design and engineering with Onsemi's MC100E143FNR2G - your go-to solution for high-quality electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Easy to mount on PCB, saves space and provides a clean appearance.

No. of Bits: 9

Provides high resolution and accuracy for data processing.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply ensures compatibility with most systems.

Propagation Delay (tpd): 1 ns

Fast signal processing speed for efficient operation.

Trigger Type: POSITIVE EDGE

Allows for precise control and timing of signal transitions.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Technical Specifications

Latches & Flip-Flops MC100E143FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

700 MHz

Trade Compliance

MC100E143FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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